參數(shù)資料
型號: LTC4306IGN#TR
廠商: Linear Technology
文件頁數(shù): 11/20頁
文件大小: 0K
描述: IC MUX 4CH 2-WIRE BUS 24-SSOP
產(chǎn)品培訓(xùn)模塊: LTC4310 - Hot-Swappable I²C Isolators
標(biāo)準(zhǔn)包裝: 2,500
應(yīng)用: 帶放大器的多路復(fù)用器
接口: SMBus(2 線/I²C)
電源電壓: 2.2 V ~ 5.5 V
封裝/外殼: 24-SSOP(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 24-SSOP
包裝: 帶卷 (TR)
安裝類型: 表面貼裝
LTC4306
19
4306f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
GN Package
24-Lead Plastic SSOP
(Reference LTC DWG # 05-08-1641)
PACKAGE DESCRIPTIO
U
.337 – .344*
(8.560 – 8.738)
GN24 (SSOP) 0204
12
3
4
5
6
7
8
9 10 11 12
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
17
18
19
20
21
22
23
24
15 1413
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38
± 0.10)
× 45°
0
° – 8° TYP
.0075 – .0098
(0.19 – 0.25)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.033
(0.838)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
UFD Package
24-Lead Plastic QFN (4mm x 5mm)
(Reference LTC DWG # 05-08-1696)
4.00
± 0.10
(2 SIDES)
2.65
± 0.10
(2 SIDES)
5.00
± 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
± 0.05
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
3.65
± 0.10
(2 SIDES)
0.75
± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.30 TYP
0.25
± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UFD24) QFN 0505
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70
±0.05
0.25
±0.05
0.50 BSC
2.65
± 0.05
(2 SIDES)
3.65
± 0.05
(2 SIDES)
4.10
± 0.05
5.50
± 0.05
3.10
± 0.05
4.50
± 0.05
PACKAGE
OUTLINE
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