參數(shù)資料
型號: LTC3879IUD#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: SWITCHING CONTROLLER, PQCC16
封裝: 3 X 3 MM, LEAD FREE, PLASTIC, MO-220WEED-4, QFN-16
文件頁數(shù): 14/28頁
文件大?。?/td> 302K
代理商: LTC3879IUD#PBF
LTC3879
21
3879f
inductor ripple current and load steps. The output voltage
ripple is given as:
ΔΔ
Ω
V
I
ESR
mmV
OUT RIPPLE
L MAX
()
(
)
. .
=
()
==
51 45
23
However, a 0A to 10A load step will cause an output
change of up to:
ΔΔ
Ω
V
I
ESR
Am
mV
OUT STEP
LOAD
()
.
=
()
==
10
4 5
45
Optional 2
× 47μF ceramic output capacitors are included
to minimize the effect of ESR and ESL in the output ripple
and to improve load step response.
PC Board Layout Checklist
The LTC3879 PC board layout can be designed with or
without a ground plane. A ground plane is generally pre-
ferred based on performance and noise concerns.
When using a ground plane, use a dedicated ground plane
layer. In addition, for high current it is recommended to
use a multilayer board to help with heat sinking power
components.
l
The ground plane layer should have no traces and be
as close as possible to the routing layer connecting the
power MOSFET’s.
l
Place LTC3879 Pins 9 to 16 facing the power compo-
nents. Keep components connected to Pin 1 close to
LTC3879 (noise sensitive components).
l
Place CIN, COUT, MOSFETs, DB and inductor all in one
compact area. It may help to have some components
on the bottom side of the board.
l
Use an immediate via to connect components to the
ground plane SGND and PGND of LTC3879. Use several
larger vias for power components.
l
Use compact switch node (SW) plane to improve cool-
ing of the MOSFETs and to keep EMI down.
l
Use planes for VIN and VOUT to maintain good voltage
ltering and to keep power losses low.
l
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
component. You can connect the copper areas to any
DC net. (VIN, VOUT, GND or to any other DC rail in your
system).
l
Place decoupling capacitor CC2 next to the ITH and SGND
pins with short, direct trace connections.
When laying out a printed circuit board without a ground
plane, use the following checklist to ensure proper op-
eration of the controller. These items are illustrated in
Figure 11.
l
Segregate the signal and power grounds. All small-signal
components should return to the SGND pin at one point.
SGND and PGND should be tied together underneath
the IC and then connect directly to the source of M2.
l
Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
l
Keep the high dV/dT SW, BOOST and TG nodes away
from sensitive small-signal nodes.
l
Connect the input capacitor(s), CIN, close to the
power MOSFETs. This capacitor carries the MOSFET AC
current.
l
Connect the INTVCC decoupling capacitor CVCC closely
to the INTVCC and PGND pins.
l
Connect the top driver boost capacitor, CB, closely to
the BOOST and SW pins.
l
Connect the VIN pin decoupling CF closely to the VIN
and PGND pins.
APPLICATIONS INFORMATION
相關(guān)PDF資料
PDF描述
LTC3880IUJ-1#TRPBF 0.1 A DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC40
LTC3880IUJ#PBF 0.1 A DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC40
LTC3880EUJ-1#TRPBF 0.1 A DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC40
LTC3880EUJ-1#PBF 0.1 A DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC40
LTC3880IUJ-1#PBF 0.1 A DUAL SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PQCC40
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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