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參數(shù)資料
| 型號(hào)： | LTC2942CDCB-1#TRMPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 電源管理 |
| 英文描述： | POWER SUPPLY SUPPORT CKT, PDSO6 |
| 封裝： | 2 X 3 MM, LEAD FREE, PLASTIC, MO-229TBD, DFN-6 |
| 文件頁數(shù)： | 6/16頁 |
| 文件大小： | 230K |
| 代理商： | LTC2942CDCB-1#TRMPBF |
LTC2942-1
29421f
applicaTions inFormaTion
where TNOM = 27°C (or 300K) and RPP(TNOM) is from
the Electrical Characteristics table. This means that the
resistance between SENSE+ and SENSE– may drop by
26% if die temperature changes from 27°C to –40°C
or increase by 23% for a 27°C to 85°C die temperature
change. Ensure that total voltage drop between SENSE+
and SENSE–, caused by maximum peak current flowing
in/out of SENSE–:
VDROP = IPEAK RPP(TDIE(MAX))
does not exceed the application’s requirements.
Limiting Inrush Current
Inrush currents during events like battery insertion or
closure of a mechanical power switch may be substan-
tially higher than peak currents during normal operation.
Extremely large inrush currents may require additional
circuitry to keep currents through the LTC2942-1 sense
resistor below the absolute maximum ratings.
NotethatexternalSchottkyclampdiodesbetweenSENSE+
and SENSE– can leak significantly, especially at high tem-
perature, which can cause significant coulomb counter
errors. Preferred solutions to limit inrush current include
active Hot Swap current limiting or connector designs
that include current limiting resistance and staggered pins
toensurealowimpedanceconnectionwhentheconnector
is fully mated.
Power Dissipation
Power dissipation in the RPP resistance when operated
at high currents can increase the die temperature sev-
eral degrees over ambient. Soldering the exposed pad
of the DFN package to a large copper region on the PCB
is recommended for applications operating close to the
specified maximum current and ambient temperature. Die
temperature at a given ISENSE can be estimated by:
TDIE = TAMB + 1.22 θJA RPP(MAX) ISENSE2
where the factor 1.22 approximates the effect of sense
resistor self-heating, RPP(MAX) is the maximum pad-to-
pad resistance at nominal temperature (27°C) and
θJA is
the thermal resistance from junction to ambient. The
θJA
data given for the DFN package is valid for typical PCB
layouts; more precise
θJA data for a particular PCB layout
may be obtained by measuring the voltage VP-P between
SENSE+ and SENSE–, the ambient temperature TAMB, and
the die temperature TDIE, and calculating:
θJA
DIE
AMB
P P SENSE
T
V
I
=
–
-
Both TAMB and TDIE temperature may be measured using
theinternaltemperaturesensorincludedintheLTC2942-1.
ISENSE should be set to zero to measure TAMB, and high
enough during TDIE measurement to achieve a significant
temperature increase over TAMB.
S
R
ALERT RESPONSE ADDRESS
DEVICE ADDRESS
29421 F08
A
1
0001100
11001001
0
1
P
A
Figure 8. LTC2942-1 Serial Bus SDA Alert Response Protocol
S
10ms
W
ADDRESS
REGISTER
S
29421 F09
A
ADDRESS
0
1100100
08h
1
0
1100100
0
P
R
0
A
F1h
DATA
80h
DATA
A
1
A
S
W
ADDRESS
REGISTER
DATA
A
0
1100100
01h
BC
0
P
Figure 9. Voltage Conversion Sequence
S
W
ADDRESS
REGISTER
S
29421 F10
A
ADDRESS
0
1100100
02h
1
0
1100100
0
P
R
0
A
80h
DATA
01h
DATA
A
1
A
Figure 10. Reading the LTC2942-1 Accumulated Charge Registers (C, D)
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