For more information www.linear.com/LTC2862 packaGe Descr" />
參數(shù)資料
型號(hào)： LTC2862IS8-1#TRPBF
廠商： Linear Technology
文件頁(yè)數(shù)： 17/26頁(yè)
文件大?。?/td> 0K
描述： IC TRANSCEIVER RS485 8-SOIC
標(biāo)準(zhǔn)包裝： 2,500
類(lèi)型： 收發(fā)器
驅(qū)動(dòng)器/接收器數(shù)： 1/1
規(guī)程： RS422，RS485
電源電壓： 3 V ~ 5.5 V
安裝類(lèi)型： 表面貼裝
封裝/外殼： 8-SOIC（0.154"，3.90mm 寬）
供應(yīng)商設(shè)備封裝： 8-SO
包裝： 帶卷 (TR)
LTC2862/LTC2863/
LTC2864/LTC2865
24
2862345fc
For more information www.linear.com/LTC2862
packaGe DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MSE12) 0213 REV G
0.53
±0.152
(.021
±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 –0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12
12 11 10 9 8 7
7
DETAIL “B”
1
6
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
RECOMMENDED SOLDER PAD LAYOUT
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845
±0.102
(.112
±.004)
2.845
±0.102
(.112
±.004)
4.039
±0.102
(.159
±.004)
(NOTE 3)
1.651
±0.102
(.065
±.004)
1.651
±0.102
(.065
±.004)
0.1016
±0.0508
(.004
±.002)
1 2 3 4 5 6
3.00
±0.102
(.118
±.004)
(NOTE 4)
0.406
±0.076
(.016
±.003)
REF
4.90
±0.152
(.193
±.006)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±0.127
(.035
±.005)
0.42
±0.038
(.0165
±.0015)
TYP
0.65
(.0256)
BSC
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G)
MSE Package
12-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev G)
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