參數(shù)資料
型號(hào): LTC2453
廠商: Linear Technology Corporation
英文描述: Easy-to-Use, Ultra-Tiny, Differential, 16-Bit ADC With I2C Interface
中文描述: 易于使用,超微型,差分,16位ADC,帶有I2C接口
文件頁(yè)數(shù): 15/16頁(yè)
文件大小: 223K
代理商: LTC2453
LTC2453
15
2453f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm
×
2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
2.00
±
0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
±
0.10
BOTTOM VIEW—EXPOSED PAD
0.56
±
0.05
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
R = 0.05
TYP
2.15
±
0.05
(2 SIDES)
3.00
±
0.10
(2 SIDES)
1
4
8
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 0905 REV B
0.25
±
0.05
2.20
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61
±
0.05
(2 SIDES)
1.15
±
0.05
0.70
±
0.05
2.55
±
0.05
PACKAGE
OUTLINE
0.25
±
0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25
×
45
°
CHAMFER
0.50 BSC
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