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參數(shù)資料
| 型號： | LTC2285IUP#PBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC DUAL 14BIT 125MSPS 64QFN |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 位數(shù)： | 14 |
| 采樣率（每秒）： | 125M |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 功率耗散（最大）： | 915mW |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 64-QFN（9x9） |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 2 個(gè)單端，雙極; 2 個(gè)差分, 雙極 |
LTC2285
23
2285fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
9 .00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
PIN 1 TOP MARK
(SEE NOTE 5)
0.40 ± 0.10
64
63
1
2
BOTTOM VIEW—EXPOSED PAD
7.15 ± 0.10
7.50 REF
(4-SIDES)
0.75 ± 0.05
R = 0.10
TYP
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UP64) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
7.50 REF
(4 SIDES)
7.15 ±0.05
8.10 ±0.05 9.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
PIN 1
CHAMFER
C = 0.35
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| LTC2285IUP-TR | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual 14-Bit, 125Msps Low Power 3V ADC |
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