AIN+ (Pin 1): Positive Differential Analog Input.
參數(shù)資料
型號(hào): LTC2233CUK#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 4/28頁(yè)
文件大?。?/td> 0K
描述: IC ADC 10BIT 80MSPS SAMPL 48QFN
標(biāo)準(zhǔn)包裝: 2,000
位數(shù): 10
采樣率(每秒): 80M
數(shù)據(jù)接口: 并聯(lián)
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 406mW
電壓電源: 單電源
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 48-WFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 48-QFN-EP(7x7)
包裝: 帶卷 (TR)
輸入數(shù)目和類(lèi)型: 1 個(gè)單端,雙極; 1 個(gè)差分,雙極
LTC2232/LTC2233
12
22323fa
AIN+ (Pin 1): Positive Differential Analog Input.
AIN– (Pin 2): Negative Differential Analog Input.
REFHA (Pins 3, 4): ADC High Reference. Bypass to Pins
5, 6 with 0.1
F ceramic chip capacitor, to Pins 9, 10 with
a 2.2
F ceramic capacitor and to ground with a 1F
ceramic capacitor.
REFLB (Pins 5, 6): ADC Low Reference. Bypass to Pins 5,
6 with 0.1
F ceramic chip capacitor. Do not connect to
Pins 9, 10.
REFHB (Pins 7, 8): ADC High Reference. Bypass to Pins
9, 10 with 0.1
F ceramic chip capacitor. Do not connect to
Pins 3, 4.
REFLA (Pins 9, 10): ADC Low Reference. Bypass to Pins
7, 8 with 0.1
F ceramic chip capacitor, to Pins 3, 4 with a
2.2
F ceramic capacitor and to ground with a 1F ceramic
capacitor.
VDD (Pins 11, 12, 14, 46, 47): 3.3V Supply. Bypass to
GND with 0.1
F ceramic chip capacitors. Adjacent pins
can share a bypass capacitor.
GND (Pins 13, 15, 45, 48): ADC Power Ground.
ENC+ (Pin 16): Encode Input. The input is sampled on the
positive edge.
ENC– (Pin 17): Encode Complement Input. The input is
sampled on the negative edge. Bypass to ground with
0.1
F ceramic for single-ended ENCODE signal.
SHDN (Pin 18): Shutdown Mode Selection Pin. Connect-
ing SHDN to GND and OE to GND results in normal
operation with the outputs enabled. Connecting SHDN to
GND and OE to VDD results in normal operation with the
outputs at high impedance. Connecting SHDN to VDD and
OE to GND results in nap mode with the outputs at high
impedance. Connecting SHDN to VDD and OE to VDD
results in sleep mode with the outputs at high impedance.
UU
U
PI FU CTIO S
OE (Pin 19): Output Enable Pin. Refer to SHDN pin
function.
CLOCKOUT (Pin 20): Data Valid Output. Latch data on the
falling edge of CLKOUT.
NC (Pins 21, 24): Do not connect these pins.
D0 – D9 (Pins 25, 26, 29, 30, 31, 34, 35, 36, 39, 40):
Digital Outputs. D9 is the MSB.
OGND (Pins 22, 27, 32, 38): Output Driver Ground.
OVDD (Pins 23, 28, 33, 37): Positive Supply for the
Output Drivers. Bypass to ground with 0.1
F ceramic chip
capacitors.
OF (Pin 41): Over/Under Flow Output. High when an over
or under flow has occurred.
MODE (Pin 42): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and turns the clock duty cycle
stabilizer off. Connecting MODE to 1/3 VDD selects offset
binary output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to 2/3 VDD selects 2’s comple-
ment output format and turns the clock duty cycle stabi-
lizer on. Connecting MODE to VDD selects 2’s complement
output format and turns the clock duty cycle stabilizer off.
SENSE (Pin 43): Reference Programming Pin. Connecting
SENSE to VCM selects the internal reference and a ±0.5V
input range. VDD selects the internal reference and a ±1V
input range. An external reference greater than 0.5V and
less than 1V applied to SENSE selects an input range of
±VSENSE. ±1V is the largest valid input range.
VCM (Pin 44): 1.6V Output and Input Common Mode Bias.
Bypass to ground with 2.2
F ceramic chip capacitor.
Exposed Pad (Pin 49): ADC Power Ground. The exposed
pad on the bottom of the package needs to be soldered to
ground.
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