參數(shù)資料
型號(hào)： LTC2205UK-14
廠商： Linear Technology Corporation
英文描述： 14-Bit, 65Msps ADC
中文描述： 14位，型號(hào)各有不同的模數(shù)轉(zhuǎn)換器
文件頁(yè)數(shù)： 27/28頁(yè)
文件大?。?/td> 1563K
代理商： LTC2205UK-14
LTC2205-14
27
220514fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UK Package
48-Lead Plastic QFN (7mm
×
7mm)
(Reference LTC DWG # 05-08-1704)
PACKAGE DESCRIPTION
7.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1
CHAMFER
C = 0.35
0.40
±
0.10
48
47
1
2
BOTTOM VIEW—EXPOSED PAD
5.50 REF
(4-SIDES)
0.75
±
0.05
R = 0.115
TYP
0.25
±
0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UK48) QFN 0406 REV C
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70
±
0.05
5.50 REF
(4 SIDES)
6.10
±
0.05 7.50
±
0.05
0.25
±
0.05
0.50 BSC
PACKAGE OUTLINE
5.15
±
0.10
5.15
±
0.10
5.15
±
0.05
5.15
±
0.05
R = 0.10
TYP
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PDF描述
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