參數(shù)資料
型號(hào): LTC1877IMS8#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: 1.5 A SWITCHING REGULATOR, 605 kHz SWITCHING FREQ-MAX, PDSO8
封裝: LEAD FREE, PLASTIC, MSOP-8
文件頁(yè)數(shù): 4/16頁(yè)
文件大小: 234K
代理商: LTC1877IMS8#TRPBF
LTC1877
12
1877fa
temperature of the part. If the junction temperature reaches
approximately 150°C, both power switches will be turned
off and the SW node will become high impedance.
To avoid the LTC1877 from exceeding the maximum junc-
tion temperature, the user will need to do some thermal
analysis. The goal of the thermal analysis is to determine
whether the power dissipated exceeds the maximum
junction temperature of the part. The temperature rise is
given by:
TR = (PD)(θJA)
where PD is the power dissipated by the regulator and θJA
is the thermal resistance from the junction of the die to
the ambient temperature.
The junction temperature, TJ, is given by:
TJ = TA + TR
where TA is the ambient temperature.
As an example, consider the LTC1877 in dropout at an
input voltage of 3V, a load current of 500mA, and an am-
bient temperature of 70°C. From the typical performance
graph of switch resistance, the RDS(ON) of the P-channel
switch at 70°C is approximately 0.9Ω. Therefore, power
dissipated by the part is:
PD = ILOAD2 RDS(ON) = 0.225W
For the MSOP package, the
θJA is 150°C/W. Thus, the
junction temperature of the regulator is:
TJ = 70°C + (0.225)(150) = 104°C
which is below the maximum junction temperature of
125°C.
Notethatathighersupplyvoltages,thejunctiontemperature
is lower due to reduced switch resistance (RDS(ON)).
Checking Transient Response
The regulator loop response can be checked by look-
ing at the load transient response. Switching regulators
take several cycles to respond to a step in load current.
When a load step occurs, VOUT immediately shifts by an
amount equal to (ΔILOAD ESR), where ESR is the effective
series resistance of COUT. ΔILOAD also begins to charge
or discharge COUT, which generates a feedback error
signal. The regulator loop then acts to return VOUT to its
steady-state value. During this recovery time VOUT can be
monitored for overshoot or ringing that would indicate a
stability problem. The internal compensation provides
adequate compensation for most applications. But if ad-
ditional compensation is required, the ITH pin can be used
for external compensation using RC, CC1, as shown in
Figure 7. The 220pF capacitor, CC2, is typically needed for
noise decoupling.
A second, more severe transient is caused by switching
in loads with large (>1μF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in paral-
lel with COUT, causing a rapid drop in VOUT. No regulator
can deliver enough current to prevent this problem if the
load switch resistance is low and it is driven quickly. The
only solution is to limit the rise time of the switch drive
so that the load rise time is limited to approximately
(25 CLOAD). Thus, a 10μF capacitor charging to 3.3V
would require a 250μs rise time, limiting the charging
current to about 130mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC1877. These items are also illustrated graphically
in the layout diagram of Figure 7. Check the following in
your layout:
1. Are the signal and power grounds segregated? The
LTC1877 signal ground consists of the resistive divider,
the optional compensation network (RC and CC1) and
CC2. The power ground consists of the (–) plate of CIN,
the (–) plate of COUT andPin4oftheLTC1877.Thepower
ground traces should be kept short, direct and wide. The
signal ground and power ground should converge to a
common node in a star-ground conguration.
2. Does the VFB pin connect directly to the feedback resis-
tors? The resistive divider R1/R2 must be connected
between the (+) plate of COUT and signal ground.
3. Does the (+) plate of CIN connect to VIN as closely as
possible? This capacitor provides the AC current to the
internal power MOSFETs.
4. Keep the switching node SW away from sensitive small
signal nodes.
APPLICATIONS INFORMATION
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