參數(shù)資料
型號(hào): LT6604IUFF-5#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 模擬信號(hào)調(diào)理
英文描述: SPECIALTY ANALOG CIRCUIT, PQCC34
封裝: 4 X 7 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-34
文件頁(yè)數(shù): 5/16頁(yè)
文件大小: 182K
代理商: LT6604IUFF-5#PBF
LT6604-5
13
66045fa
TYPICAL APPLICATIONS
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and total
supply current, IS. Therefore, the junction temperature is
given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS, is a function of signal level,
load impedance, temperature and common mode volt-
ages. For a given supply voltage, the worst-case power
dissipation occurs when the differential input signal is
maximum, the common mode currents are maximum (see
the Applications Information section regarding Common
Mode DC Currents), the load impedance is small and
the ambient temperature is maximum. To compute the
junction temperature, measure the supply current under
these worst-case conditions, use 43°C/W as the package
thermal resistance, then apply the equation for TJ. For
example, using the circuit in Figure 3 with DC differential
input voltage of 250mV, a differential output voltage of 1V,
1k load resistance and an ambient temperature of 85°C,
the supply current (current into V+) measures 32.2mA per
channel. The resulting junction temperature is: TJ = TA +
(PD θJA) = 85 + (5 2 0.0322 43) = 99°C. The thermal
resistance can be affected by the amount of copper on the
PCB that is connected to V. The thermal resistance of the
circuit can increase if the exposed pad is not connected
to a large ground plane with a number of vias.
+
+
3V
RIN
VOCM
(1V-1.5V)
IIN
QIN
QOUT
IOUT
RIN
0.1μF
0.01μF
0.1μF
GAIN =
806Ω
RIN
5MHz PHASE (DEG)
PERCENT
AGE
OF
UNITS
(%)
66045 TA02
30
25
20
15
10
5
0
–134.5 –134 –133.5 –133 –132.5 –132
25
27
29
7
34
4
6
2
17
19
21
24
8
12
14
10
1/2
LT6604-5
1/2
LT6604-5
Dual, Matched, 5MHz Lowpass Filter
5MHz Phase Distribution
(50 Units)
APPLICATIONS INFORMATION
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