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參數資料
| 型號： | LT3845EFE#TR |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | SWITCHING CONTROLLER, 600 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封裝： | 4.40 MM, PLASTIC, TSSOP-16 |
| 文件頁數： | 22/24頁 |
| 文件大?。?/td> | 263K |
| 代理商： | LT3845EFE#TR |
LT3845
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BG (Pin 12): The BG pin is the gate drive for the bottom
N-channel MOSFET. Since very fast high currents are driven
from this pin, connect it to the gate of the power MOSFET
with a short and wide, typically 0.02" width, PCB trace to
minimize inductance.
VCC (Pin 13): The VCC pin is the internal bias supply
decoupling node. Use a low ESR, 1μF or greater ceramic
capacitor to decouple this node to PGND. Most internal IC
functions are powered from this bias supply. An external
diode connected from VCC to the BOOST pin charges the
bootstrapped capacitor during the off-time of the main
power switch. Back driving the VCC pin from an external
DC voltage source, such as the VOUT output of the regula-
tor supply, increases overall efciency and reduces power
dissipation in the IC. In shutdown mode this pin sinks
20μA until the pin voltage is discharged to 0V.
SW (Pin 14): Reference for VBOOST Supply and High Cur-
rent Return for Bootstrapped Switch.
TG (Pin 15): The TG pin is the bootstrapped gate drive for
the top N-Channel MOSFET. Since very fast high currents
are driven from this pin, connect it to the gate of the power
MOSFET with a short and wide, typically 0.02” width, PCB
trace to minimize inductance.
PIN FUNCTIONS
BOOST (Pin 16): The BOOST pin is the supply for the
bootstrapped gate drive and is externally connected to a
low ESR ceramic boost capacitor referenced to SW pin.
The recommended value of the BOOST capacitor,CBOOST,
is at least 50 times greater than the total gate capacitance
of the topside MOSFET. In most applications 0.1μF is
adequate. The maximum voltage that this pin sees is VIN
+ VCC, ground referred.
SGND (Pin 17): The SGND pin is the low noise ground
reference. It should be connected to the –VOUT side of the
output capacitors. Careful layout of the PCB is necessary
to keep high currents away from this SGND connection.
See the Application Information section for helpful hints
on PCB layout of grounds.
Exposed Pad (SGND) (Pin 17): The exposed leadframe is
internally connected to the SGND pin. Solder the exposed
pad to the PCB ground for electrical contact and optimal
thermal performance.
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