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參數(shù)資料
| 型號： | LT1761-2 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | 100mA, Low Noise, LDO Micropower Regulators in SOT-23(2V輸出，100mA,低噪聲，低壓差穩(wěn)壓器（SOT-23封裝）) |
| 中文描述： | 100mA的，低噪聲，LDO穩(wěn)壓器采用SOT微功耗穩(wěn)壓- 23（2V的輸出，100mA的，低噪聲，低壓差穩(wěn)壓器（采用SOT - 23封裝）） |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 197K |
| 代理商： | LT1761-2 |
14
LT1761 Series
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125
°
C). The
power dissipated by the device will be made up of two
components:
1. Output current multiplied by the input/output voltage
differential: (I
OUT
)(V
IN
– V
OUT
), and
2. GND pin current multiplied by the input voltage:
(I
GND
)(V
IN
).
The ground pin current can be found by examining the
GND Pin Current curves in the Typical Performance Char-
acteristics section. Power dissipation will be equal to the
sum of the two components listed above.
The LT1761 series regulators have internal thermal limit-
ing designed to protect the device during overload condi-
tions. For continuous normal conditions, the maximum
junction temperature rating of 125
°
C must not be
exceeded. It is important to give careful consideration to
all sources of thermal resistance from junction to ambient.
Additional heat sources mounted nearby must also be
considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following table lists thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. Measured Thermal Resistance
COPPER AREA
TOPSIDE*
BACKSIDE
2500mm
2
2500mm
2
1000mm
2
2500mm
2
225mm
2
2500mm
2
100mm
2
2500mm
2
50mm
2
2500mm
2
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
125
°
C/W
125
°
C/W
130
°
C/W
135
°
C/W
150
°
C/W
BOARD AREA
2500mm
2
2500mm
2
2500mm
2
2500mm
2
2500mm
2
*Device is mounted on topside.
APPLICATIO
S I
FOR
ATIO
U
W
U
U
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4V to 6V, an output current range of 0mA to 50mA
and a maximum ambient temperature of 50
°
C, what will
the maximum junction temperature be
The power dissipated by the device will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 50mA
V
IN(MAX)
= 6V
I
GND
at (I
OUT
= 50mA, V
IN
= 6V) = 1mA
So,
P = 50mA(6V – 3.3V) + 1mA(6V) = 0.14W
The thermal resistance will be in the range of 125
°
C/W to
150
°
C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
0.14W(150
°
C/W) = 21.2
°
C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50
°
C + 21.2
°
C = 71.2
°
C
Protection Features
The LT1761 regulators incorporate several protection
features which make them ideal for use in battery-powered
circuits. In addition to the normal protection features
associated with monolithic regulators, such as current
limiting and thermal limiting, the devices are protected
against reverse input voltages, reverse output voltages
and reverse voltages from output to input.
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal opera-
tion, the junction temperature should not exceed 125
°
C.
The input of the device will withstand reverse voltages of
20V. Current flow into the device will be limited to less than
1mA (typically less than 100
μ
A) and no negative voltage
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