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參數(shù)資料
| 型號： | LT1739IUE#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 3/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP XDSL LINE DVR DUAL 12-DFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 線路驅(qū)動(dòng)器，發(fā)射器 |
| 驅(qū)動(dòng)器/接收器數(shù)： | 2/0 |
| 電源電壓： | 5 V ~ 12 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 12-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 12-DFN（4x3） |
| 包裝： | 帶卷 (TR) |
11
LT1739
1739fas, sn1739
APPLICATIO S I FOR ATIO
WU
UU
Figure 8. Examples of PCB Metal Used for Heat Dissipation. Driver Package Mounted on Top Layer.
Heat Sink Pad Soldered to Top Layer Metal. Metal Areas Drawn to Scale of Package Size
When PCB cards containing multiple ports are inserted
into a rack in an enclosed cabinet, it is often necessary to
provide airflow through the cabinet and over the cards. As
seen in the graph of Figure 8, this is also very effective in
further reducing the junction-to-ambient thermal resis-
tance of each line driver.
STILL AIR
θJA
TSSOP
100
°C/W
TSSOP
50
°C/W
TSSOP
45
°C/W
DFN
130
°C/W
PACKAGE
TOP LAYER
2ND LAYER
3RD LAYER
BOTTOM LAYER
DFN
75
°C/W
1739 F08a
AIRFLOW (LINEAR FEET PER MINUTE, lfpm)
–50
–60
REDUCTION
IN
θ
JA
(%)
–30
–10
0
–40
–20
200
400
600
800
1739 F08b
1000
100
0
300
500
Typical Reduction in
θJA with
Laminar Airflow Over the Device
700
900
% REDUCTION RELATIVE
TO
θJA IN STILL AIR
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