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| 型號： | LPC2132FHN64 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 數(shù)學處理器 |
| 英文描述： | Single-chip 16-32-bit microcontrollers; 32-64-128-256-512 kB ISP-IAP flash with 10-bit ADC and DAC |
| 封裝： | LPC2131FBD64/01<SOT314-2 (LQFP64)|<<http://www.nxp.com/packages/SOT314-2.html<1<Always Pb-free,;LPC2131FBD64/01<SOT314-2 (LQFP64)|<<http://www.nxp.com/packages/SOT314-2.h |
| 文件頁數(shù)： | 38/45頁 |
| 文件大小： | 381K |
| 代理商： | LPC2132FHN64 |
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LPC2131_32_34_36_38
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5.1 — 29 July 2011
38 of 45
NXP Semiconductors
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
12.2 RTC 32 kHz oscillator component selection
The RTC external oscillator circuit is shown in
Figure 15
. Since the feedback resistance is
integrated on chip, only a crystal, the capacitances C
X1
and C
X2
need to be connected
externally to the microcontroller.
Table 12
gives the crystal parameters that should be used. C
L
is the typical load
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
L
influences oscillation frequency. When using a crystal that is manufactured for a
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in
Table 12
that belong to a specific C
L
. The value of external capacitances C
X1
and C
X2
specified in
this table are calculated from the internal parasitic capacitances and the C
L
. Parasitics
from PCB and package are not taken into account.
Table 12.
Crystal load capacitance
C
L
11 pF
13 pF
15 pF
12.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
x1
, C
x2
, and C
x3
in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plane. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
x1
and C
x2
should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Fig 15. RTC oscillator modes and models: oscillation mode of operation and external
crystal model used for C
X1
/C
X2
evaluation
Recommended values for the RTC external 32 kHz oscillator C
X1
/C
X2
components
Maximum crystal series
resistance R
S
< 100 k
< 100 k
< 100 k
External load capacitors C
X1
/C
X2
18 pF, 18 pF
22 pF, 22 pF
27 pF, 27 pF
002aaf495
LPC2xxx
RTCX1
RTCX2
CX2
CX1
32 kHz XTAL
=
CL
CP
RS
L
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相關代理商/技術參數(shù) |
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|---|---|
| LPC2132FHN64,557 | 功能描述:ARM微控制器 - MCU 64K FL/16K RM/10B ADC/LV RTC RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風格:SMD/SMT |
| LPC2132FHN64/01 | 功能描述:ARM微控制器 - MCU ARM7 64KF/16KR/ADC RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風格:SMD/SMT |
| LPC2132FHN64/01,55 | 功能描述:ARM微控制器 - MCU ARM7 64KF/16KR/ADC RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風格:SMD/SMT |
| LPC2134 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM7-based microcontrollers with two 10-bit ADCs and 10-bit DAC |
| LPC2134-01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM7-based microcontrollers with two 10-bit ADCs and 10-bit DAC |
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