- 您現在的位置：買賣IC網 > PDF目錄11153 > LPC2103FBD48,118 (NXP Semiconductors)IC ARM7 MCU FLASH 32K 48-LQFP PDF資料下載
參數資料
| 型號： | LPC2103FBD48,118 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 28/37頁 |
| 文件大小： | 0K |
| 描述： | IC ARM7 MCU FLASH 32K 48-LQFP |
| 標準包裝： | 2,000 |
| 系列： | LPC2100 |
| 核心處理器： | ARM7 |
| 芯體尺寸： | 16/32-位 |
| 速度： | 70MHz |
| 連通性： | I²C，Microwire，SPI，SSI，SSP，UART/USART |
| 外圍設備： | POR，PWM，WDT |
| 輸入/輸出數： | 32 |
| 程序存儲器容量： | 32KB（32K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 8K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.65 V ~ 3.6 V |
| 數據轉換器： | A/D 8x10b |
| 振蕩器型： | 內部 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 48-LQFP |
| 包裝： | 帶卷 (TR) |
| 配用： | 568-4302-ND - BOARD EVAL LPC210X KS2103 JLINK 568-4301-ND - BOARD EVAL LPC210X KS2103 568-4300-ND - BOARD EVAL LPC210X MCB2103 568-4297-ND - BOARD EVAL LPC21XX MCB2100 MCB2103UME-ND - BOARD EVAL MCB2103 + ULINK-ME MCB2103U-ND - BOARD EVAL MCB2103 + ULINK2 622-1013-ND - BOARD FOR LPC2103 48-LQFP 622-1008-ND - BOARD FOR LPC9103 10-HVSON |
| 其它名稱： | 935280966118 LPC2103FBD48-T LPC2103FBD48-T-ND |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁當前第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁
PIC18F85J90 FAMILY
DS39770C-page 34
2010 Microchip Technology Inc.
2.6
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
secondary
oscillator
(refer
to
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times, and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC and PICmicro Devices”
AN849, “Basic PICmicro Oscillator Design”
AN943, “Practical PICmicro Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
2.7
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
FIGURE 2-4:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
OSC1
OSC2
T1OSO
T1OS I
Copper Pour
Primary Oscillator
Crystal
Timer1 Oscillator
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
T1 Oscillator: C1
T1 Oscillator: C2
(tied to ground)
Single-Sided and In-Line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
相關PDF資料 |
PDF描述 |
|---|---|
| VI-B6B-IW-F3 | CONVERTER MOD DC/DC 95V 100W |
| VI-B6B-IW-F2 | CONVERTER MOD DC/DC 95V 100W |
| VI-B63-IX-F4 | CONVERTER MOD DC/DC 24V 75W |
| MAX4619CUE+T | IC MULTIPLEXER TRPL 1X2 16TSSOP |
| MAX4528ESA+T | IC SWITCH DUAL SPDT 8SOIC |
相關代理商/技術參數 |
參數描述 |
|---|---|
| LPC2103FBD48151 | 制造商:NXP Semiconductors 功能描述:IC 32BIT MCU ARM7 70MHZ LQFP-48 |
| LPC2103FBD48CP3255 | 制造商:NXP Semiconductors 功能描述:- Tape and Reel |
| LPC2103FBD48-S | 制造商:NXP Semiconductors 功能描述:IC, 32BIT MCU, ARM7, 75MHZ, LQFP-48; Controller Family/Series:(ARM7); Core Size:32bit; No. of I/O's:32; Supply Voltage Min:1.65V; Supply Voltage Max:1.95V; Digital IC Case Style:LQFP; No. of Pins:48; Program Memory Size:32KB ;RoHS Compliant: Yes |
| LPC2103FBD48-T | 功能描述:ARM微控制器 - MCU 32K FL/8K RAM/8CH 10-B ADC RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數據總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數據 RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風格:SMD/SMT |
| LPC2103FHN48 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB flash with ISP/IAP, fast ports and 10-bit ADC |
發(fā)布緊急采購，3分鐘左右您將得到回復。