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參數(shù)資料
型號(hào): LPC2102FBD48,118
廠商: NXP Semiconductors
文件頁(yè)數(shù): 27/37頁(yè)
文件大?。?/td> 0K
描述: IC ARM7 MCU FLASH 16K 48-LQFP
標(biāo)準(zhǔn)包裝: 2,000
系列: LPC2100
核心處理器: ARM7
芯體尺寸: 16/32-位
速度: 70MHz
連通性: I²C,Microwire,SPI,SSI,SSP,UART/USART
外圍設(shè)備: POR,PWM,WDT
輸入/輸出數(shù): 32
程序存儲(chǔ)器容量: 16KB(16K x 8)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 1.65 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 48-LQFP
包裝: 帶卷 (TR)
2010 Microchip Technology Inc.
DS39770C-page 33
PIC18F85J90 FAMILY
2.4
Voltage Regulator Pins (ENVREG
and VCAP/VDDCORE)
The on-chip voltage regulator enable pin, ENVREG,
must always be connected directly to either a supply
voltage or to ground. Tying ENVREG to VDD enables
the regulator, while tying it to ground disables the
Regulator” for details on connecting and using the
on-chip regulator.
When the regulator is enabled, a low-ESR (< 5)
capacitor is required on the VCAP/VDDCORE pin to
stabilize the voltage regulator output voltage. The
VCAP/VDDCORE pin must not be connected to VDD and
must use a capacitor of 10
F connected to ground. The
type can be ceramic or tantalum. A suitable example is
the Murata GRM21BF50J106ZE01 (10
F, 6.3V) or
equivalent. Designers may use Figure 2-3 to evaluate
ESR equivalence of candidate devices.
It is recommended that the trace length not exceed
0.25 inch (6 mm). Refer to Section 26.0 “Electrical
Characteristics” for additional information.
When the regulator is disabled, the VCAP/VDDCORE pin
must be tied to a voltage supply at the VDDCORE level.
information on VDD and VDDCORE.
Note that the “LF” versions of some low pin count
PIC18FJ parts (e.g., the PIC18LF45J10) do not have
the ENVREG pin. These devices are provided with the
voltage regulator permanently disabled; they must
always be provided with a supply voltage on the
VDDCORE pin.
FIGURE 2-3:
FREQUENCY vs. ESR
PERFORMANCE FOR
SUGGESTED VCAP
2.5
ICSP Pins
The PGC and PGD pins are used for In-Circuit Serial
Programming (ICSP) and debugging purposes. It
is recommended to keep the trace length between the
ICSP connector and the ICSP pins on the device as
short as possible. If the ICSP connector is expected to
experience an ESD event, a series resistor is recom-
mended, with the value in the range of a few tens of
ohms, not to exceed 100.
Pull-up resistors, series diodes, and capacitors on the
PGC and PGD pins are not recommended as they will
interfere with the programmer/debugger communica-
tions to the device. If such discrete components are an
application requirement, they should be removed from
the circuit during programming and debugging. Alter-
natively, refer to the AC/DC characteristics and timing
requirements information in the respective device
Flash programming specification for information on
capacitive loading limits, and pin input voltage high
(VIH) and input low (VIL) requirements.
For device emulation, ensure that the “Communication
Channel Select” (i.e., PGCx/PGDx pins) programmed
into the device matches the physical connections for
the ICSP to the Microchip debugger/emulator tool.
For
more
information
on
available
Microchip
development tools connection requirements, refer
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
1000 10,000
Frequency (MHz)
ES
R
(
)
Note:
Data for Murata GRM21BF50J106ZE01 shown.
Measurements at 25°C, 0V DC bias.
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