參數(shù)資料
型號: LPC11U24FHN33/401,
廠商: NXP Semiconductors
文件頁數(shù): 62/74頁
文件大?。?/td> 0K
描述: MCU USB 33HVQFN
產(chǎn)品培訓(xùn)模塊: Code Density for LPC11xx
標(biāo)準(zhǔn)包裝: 260
系列: LPC11Uxx
核心處理器: ARM? Cortex?-M0
芯體尺寸: 32-位
速度: 50MHz
連通性: I²C,Microwire,SPI,SSI,SSP,UART/USART,USB
外圍設(shè)備: 欠壓檢測/復(fù)位,POR,WDT
輸入/輸出數(shù): 26
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大小: 4K x 8
RAM 容量: 10K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 32-VQFN 裸露焊盤
包裝: 托盤
其它名稱: 568-8524
LPC11U24FHN33/401,-ND
LPC11U2X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.2 — 11 March 2014
65 of 74
NXP Semiconductors
LPC11U2x
32-bit ARM Cortex-M0 microcontroller
Fig 40. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45
DM
evia
=
1.05
W = 0.30 CU
evia
=
4.25
evia = 2.40
LbE
=
5.80
CU
LbD = 5.80 CU
PIE
=
7.25
P
A+OA
LaE
=
7.95
CU
LaD = 7.95 CU
OIE
=
8.20
OA
OwEtot
=
5.10
OA
EHS
=
4.85
CU
DHS = 4.85 CU
4.55
SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot
=
2.70
SP
SDhtot = 2.70 SP
GapE
=
0.70
SP
SPE
=
1.00
SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP
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LPC11U34FBD48/311, 功能描述:ARM微控制器 - MCU 32-bit ARM Cortex-M0 40KB Flash, 8KB SRAM RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT