參數(shù)資料
型號(hào)： LP5527
廠商： National Semiconductor Corporation
英文描述： Tiny LED Driver for Camera Flash and 4 LEDs with I2C Programmability, Connectivity Test and Audio Synchronization
中文描述： 微小的LED照相機(jī)閃光燈和4的I2C可編程性，連接測(cè)試和音頻同步發(fā)光二極管驅(qū)動(dòng)器
文件頁(yè)數(shù)： 4/21頁(yè)
文件大?。?/td> 829K
代理商： LP5527
Absolute Maximum Ratings
(Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Voltage on power pins (V
DD1,2
)
Voltage on analog pins
-0.3V to +6.0V
-0.3V to V
DD1,2
+0.3V
with 6.0V max
-0.3V to V
DD1,2
+0.3V
with 6.0V max
-0.3V to 6.0V
Voltage on input/output pins
V(all other pins): Voltage to GND
I(V
REF
)
I(FLASH)
Continuous Power Dissipation
(Note 3)
Junction Temperature (T
J-MAX
)
Storage Temperature Range
Maximum Lead Temperature
(Reflow soldering, 3 times)
(Note 4)
10 μA
500 mA
Internally Limited
125
o
C
-65
o
C to +150
o
C
260
o
C
ESD Rating (Note 5)
Human Body Model
2 kV
Operating Ratings
(Note 1)
,
(Note 2)
Voltage on power pins (V
DD1,2
)
Voltage on ASE1, ASE2
V
DD_IO
Junction Temperature (T
J
) Range
Ambient Temperature (T
A
) Range
(Note 6)
3.0 to 5.5V
0V to 1.6V
1.65V to V
DD1
-30
o
C to +125
o
C
-30
o
C to +85
o
C
Thermal Properties
Junction-to-Ambient Thermal
Resistance (
θ
JA
),
TLA3011A Package (Note 7)
60 - 100
o
C/W
Electrical Characteristics
(Notes 2, 8)
Limits in standard typeface are for T
J
= 25
o
C. Limits in boldface type apply over the operating ambient temperature range
(-30
o
C
<
T
A
<
+85
o
C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: V
IN
= 3.6V, C
IN
=
10 μF, C
OUT1
= 10 μF, C
OUT2
= 10 μF, C
VDD_IO
= 100 nF, C
VREF
= 100 nF, C
VDDA
= 4.7 μF, C
VDD1
= 100 nF, C
VDD2
= 100
nF, L
1
= 4.7 μH. (Note 9)
Symbol
Parameter
I
SHUT DOWN
Current of V
DD1
+ V
DD2
pins +
Leakage Current of SW1, SW2,
LED1 to 4 and FLASH
I
DD
Active Mode Supply Current
(V
DD1
+ V
DD2
current)
EN_BOOST(bit) = L, SCL, SDA = H
I
DD
No load supply current
(V
DD1
+ V
DD2
current)
SCL, SDA, NRST = H,
AUTOLOAD_EN(bit) = L
I
VDDIO
V
DD_IO
Standby Supply current
V
DDA
Condition
Min
Typ
1
Max
5
Units
μA
Voltage on V
DD_IO
= 0V, NRST = L,
NSTBY(bit) = L
NRST = H, NSTBY(bit) = H, no load,
350
μA
NSTBY(bit) = H, EN_BOOST(bit) = H,
850
μA
NSTBY(bit) = L
I
VDDA
= 1 mA
1
μA
V
-4%
2,8V
+4%
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pins.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
=160
o
C (typ.) and disengages at
T
J
=140
o
C (typ.).
Note 4:
For detailed soldering specifications and information, please refer to National SemiconductorApplication NoteAN1112 : Micro SMD Wafer Level Chip Scale
Package.
Note 5:
The Human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. MIL-STD-883 3015.7
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125
o
C), the maximum power
dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the part/package in the application (
θ
JA
), as given by the
following equation: T
A-MAX
= T
J-MAX-OP
– (
θ
JA
x P
D-MAX
).
Note 7:
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
Note 8:
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9:
Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics.
L
www.national.com
4
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