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參數(shù)資料
| 型號： | LP2960AIN-5.0 |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Circular Connector; No. of Contacts:41; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:20; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:20-41 RoHS Compliant: No |
| 中文描述： | FIXED/ADJUSTABLE POSITIVE LDO REGULATOR, 0.8 V DROPOUT, PDIP16 |
| 封裝： | PLASTIC, DIP-16 |
| 文件頁數(shù)： | 13/17頁 |
| 文件大?。?/td> | 452K |
| 代理商： | LP2960AIN-5.0 |
Application Hints
(Continued)
The next parameter which must be calculated is the maxi-
mum allowable temperature rise, T
R
(max). This is calcu-
lated by using the formula:
T
R
(max) = T
J
(max) T
A
(max)
where:
T
(max) is the maximum allowable junction temperature,
which is 125C for commercial grade parts.
T
(max) is the maximum ambient temperature which will be
encountered in the application.
Using the calculated values for T
(max) and P
, the maxi-
mum allowable value for the junction-to-ambient thermal re-
sistance,
θ
(JA)
, can now be found:
θ
(JA)
= T
R
(max)/P
D
The heatsink for the LP2960 is made using the PC board
copper, with the heat generated on the die being conducted
through the lead frame and out to the pins which are sol-
dered to the PC board.
The GND pins are the only ones capable of conducting any
significant amount of heat, as they are internally attached to
the lead frame on which the die is mounted.
The figure below shows recommended copper foil patterns
to be used for heatsinking the DIP and Surface Mount pack-
ages:
The table below shows measured values of
θ
(JA)
for a PC
board with 1 ounce copper weight:
Package
L (in.)
1
2
1
2
H (in.)
0.5
0.2
0.5
0.2
θ
JA
(C/W)
50
52
72
74
DIP
Surface
Mount
As the heat must transfer from the copper to the surrounding
air, best results (lowest
θ
) will be obtained by using a sur-
face copper layer with the solder resist opened up over the
heatsink area.
If an internal copper layer of a multi-layer board is used for
heatsinking, the board material acts as an insulator, inhibit-
ing heat transfer and increasing
θ
JA
.
As with any heatsink, increasing the airflow across the board
will significantly improve the heat transfer.
Heat Sink Foil Patterns
DS011962-31
www.national.com
13
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LP2960IM-3.3 | 功能描述:低壓差穩(wěn)壓器 - LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LP2960IM-3.3 | 制造商:Texas Instruments 功能描述:V REG LDO +3.3V SMD 2960 SOIC16 |
| LP2960IM-3.3/NOPB | 功能描述:低壓差穩(wěn)壓器 - LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LP2960IM-5.0 | 功能描述:低壓差穩(wěn)壓器 - LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LP2960IM-5.0/NOPB | 功能描述:低壓差穩(wěn)壓器 - LDO Adj Micropower 0.5A LDO Regulators RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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