參數(shù)資料
型號(hào): LMA419
英文描述: LOW NOISE PHEMT MMIC
中文描述: 低噪聲PHEMT器件單片
文件頁(yè)數(shù): 3/4頁(yè)
文件大小: 138K
代理商: LMA419
LMA419
L
OW
N
OISE
PHEMT
MMIC
Phone:
(408) 988-1845
Fax:
(408) 970-9950
http://
www.filss.com
Revised:
12/05/00
Email:
sales@filss.com
ASSEMBLY DRAWING
Notes:
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
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LMA420 LOW NOISE PHEMT MMIC
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相關(guān)代理商/技術(shù)參數(shù)
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LMA420 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC
LMA421 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC
LMA422 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC
LMA441 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:MEDIUM POWER PHEMT MMIC
LMA442 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:MEDIUM POWER PHEMT MMIC