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參數(shù)資料
| 型號(hào)： | LMA208G |
| 英文描述： | 2-26GHz PHEMT Amplifier |
| 中文描述： | 2 - 26GHz PHEMT器件放大器 |
| 文件頁(yè)數(shù)： | 2/4頁(yè) |
| 文件大?。?/td> | 158K |
| 代理商： | LMA208G |
Filtronic
Solid State
2-26GHz PHEMT Amplifier
LMA208G
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Assembly Diagram
STANDARD BIAS
Notes:
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C. Maximum
time at temperature is 1 minute. Use of forming gas (90% N
2
, 10% H
2
) for best results.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
DSS 010 WC
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LMA219B | LOW NOISE PHEMT MMIC |
| LMA246 | LOW NOISE PHEMT MMIC |
| LMA406 | LOW NOISE PHEMT MMIC |
| LMA411 | LOW NOISE PHEMT MMIC |
| LMA417 | MEDIUM POWER PHEMT MMIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LMA219B | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA246 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA406 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA411 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA417 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:MEDIUM POWER PHEMT MMIC |
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