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參數(shù)資料
| 型號(hào)： | LM90 |
| 廠商： | National Semiconductor Corporation |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | 3 Degree Celcious Accurate, Remote Diode and Local Digital Temperature Sensor with Two-Wire Interface |
| 中文描述： | 3度Celcious精確，遠(yuǎn)程二極管和本地?cái)?shù)字溫度傳感器兩線接口 |
| 文件頁數(shù)： | 6/20頁 |
| 文件大?。?/td> | 384K |
| 代理商： | LM90 |
SMBus DIGITAL SWITCHING CHARACTERISTICS
Unless otherwise noted, these specifications apply for V
DD
=+3.0 Vdc to +3.6 Vdc, C
(load capacitance) on output lines = 80
pF.
Boldface limits apply for T
= T
= T
to T
;
= T
= +25C, unless otherwise noted.
The switching characteristics of the LM90 fully meet or exceed the published specifications of the SMBus version 2.0. The fol-
lowing parameters are the timing relationships between SMBCLK and SMBData signals related to the LM90. They adhere to
but are not necessarily the SMBus bus specifications.
Symbol
Parameter
Conditions
Typical
(Note 6)
Limits
(Note 7)
0.6
Units
(Limit)
μs (min)
t
SU;STA
SMBus Repeated Start-Condition Setup
Time, SMBCLK High to SMBData Low
SMBus Free Time Between Stop and Start
Conditions
t
BUF
1.3
μs (min)
SMBus Communication
20033740
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions.
Note 2:
When the input voltage (V
I
) at any pin exceeds the power supplies (V
I
<
GND or V
I
>
V
DD
), the current at that pin should be limited to 5 mA.
Parasitic components and or ESD protection circuitry are shown in the figure below for the LM90’s pins. The nominal breakdown voltage of D3 is 6.5 V. Care should
be taken not to forward bias the parasitic diode, D1, present on pins: D+, D. Doing so by more than 50 mV may corrupt a temperature measurements.
Pin Name
V
DD
D+
D
T_CRIT_A
ALERT
SMBData
SMBCLK
PIN
#
1
2
3
4
6
7
8
D1
D2
D3
D4
D5
D6
D7
R1
SNP
ESD CLAMP
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Note: An “x” indicates that the diode exists.
Note 3:
See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices.
Note 4:
Human body model, 100pF discharged through a 1.5k
resistor. Machine model, 200pF discharged directly into each pin.
Note 5:
Thermal resistance junction-to-ambient when attached to a printed circuit board with 2 oz. foil:
– MSOP-8 = 210C/W
Note 6:
Typicals are at T
A
= 25C and represent most likely parametric norm.
20033713
FIGURE 1. ESD Protection Input Structure
L
www.national.com
6
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