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參數(shù)資料
| 型號： | LM4856ITL |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | Integrated Audio Amplifier System |
| 中文描述： | 1.1 W, 3 CHANNEL, AUDIO AMPLIFIER, PBGA18 |
| 封裝： | MICRO SMD-18 |
| 文件頁數(shù)： | 16/23頁 |
| 文件大小： | 1321K |
| 代理商： | LM4856ITL |
Application Information
(Continued)
TABLE 3. Volume Control
V4
V3
V2
V1
V0
Gain (dB)
G2
G1
P
HS
to
R
IN
, L
IN
to
R
OUT
, L
OUT
-34.5
-33.0
-31.5
-30.0
-28.5
-27.0
-25.5
-24.0
-22.5
-21.0
-19.5
-18.0
-16.5
-15.0
-13.5
-12.0
-10.5
-9.0
-7.5
-6.0
-4.5
-3.0
-1.5
0.0
1.5
3.0
4.5
6.0
7.5
9.0
10.5
12.0
R
OUT
, L
OUT
-40.5
-39.0
-37.5
-36.0
-34.5
-33.0
-31.5
-30.0
-28.5
-27.0
-25.5
-24.0
-22.5
-21.0
-19.5
-18.0
-16.5
-15.0
-13.5
-12.0
-10.5
-9.0
-7.5
-6.0
-4.5
-3.0
-1.5
0.0
1.5
3.0
4.5
6.0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
EXPOSED-DAP MOUNTING CONSIDERATIONS
The LM4856’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper area heatsink, copper traces, ground plane, and
finally, surrounding air. The result is a low voltage audio
power amplifier that produces 1.1W dissipation in a 8
load
at
≤
1% THD+N. This high power is achieved through careful
consideration of necessary thermal design. Failing to opti-
mize thermal design may compromise the LM4856’s high
power performance and activate unwanted, though neces-
sary, thermal shutdown protection.
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is then, ideally,
connected to a large plane of continuous unbroken copper.
This plane forms a thermal mass, heat sink, and radiation
area. Place the heat sink area on either outside plane in the
case of a two-sided or multi-layer PCB. (The heat sink area
can also be placed on an inner layer of a multi-layer board.
The thermal resistance, however, will be higher.) Connect
the DAP copper pad to the inner layer or backside copper
heat sink area with 6 (3 X 2) (LD) vias. The via diameter
should be 0.012in - 0.013in with a 1.27mm pitch. Ensure
efficient thermal conductivity by plugging and tenting the vias
with plating and solder mask, respectively.
Best thermal performance is achieved with the largest prac-
tical copper heat sink area. If the heatsink and amplifier
share the same PCB layer, a nominal 2.5in
2
(min) area is
necessary for 5V operation with a 4
load. Heatsink areas
L
www.national.com
16
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LM4856 | Integrated Audio Amplifier System |
| LM4856LQ | Integrated Audio Amplifier System |
| LM4860 | Series 1W Audio Power Amplifier with Shutdown Mode |
| LM4860M | Series 1W Audio Power Amplifier with Shutdown Mode |
| LM4861 | 1.1W Audio Power Amplifier with Shutdown Mode |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM4856ITL/NOPB | 功能描述:IC AMP AUDIO PWR 1.5W AB 18USMD RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4856LQ | 制造商:Texas Instruments 功能描述:1W MONO 100MW STEREO SUBSYST 4856 |
| LM4856LQ/NOPB | 功能描述:IC AMP AUDIO PWR 1.5W MONO 24LLP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:2,500 系列:DirectDrive® 類型:H 類 輸出類型:耳機(jī)，2-通道（立體聲） 在某負(fù)載時最大輸出功率 x 通道數(shù)量:35mW x 2 @ 16 歐姆 電源電壓:1.62 V ~ 1.98 V 特點:I²C，麥克風(fēng)，靜音，短路保護(hù)，音量控制 安裝類型:表面貼裝 供應(yīng)商設(shè)備封裝:25-WLP（2.09x2.09） 封裝/外殼:25-WFBGA，WLCSP 包裝:帶卷 (TR) |
| LM4856LQBD | 功能描述:BOARD EVALUATION LM4856LQ RoHS:否 類別:編程器，開發(fā)系統(tǒng) >> 評估板 - 音頻放大器 系列:Boomer® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- |
| LM4857 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Stereo 1.2W Audio Sub-system with 3D Enhancement |
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