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PACKAGE OPTION ADDENDUM
www.ti.com
18-Aug-2010
Addendum-Page 16
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
LM4040D82IDBZR
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82IDBZRG4
ACTIVE
SOT-23
DBZ
3
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82IDBZT
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82IDBZTG4
ACTIVE
SOT-23
DBZ
3
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82IDCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82IDCKRG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
LM4040D82ILP
ACTIVE
TO-92
LP
3
1000
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM4040D82ILPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM4040D82ILPR
ACTIVE
TO-92
LP
3
2000
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
LM4040D82ILPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free (RoHS)
CU SN
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.