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參數(shù)資料
| 型號： | LM2704MFX-ADJ/NOPB |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 0.62 A SWITCHING REGULATOR, PDSO5 |
| 封裝： | SOT-23, 5 PIN |
| 文件頁數(shù)： | 5/11頁 |
| 文件大?。?/td> | 312K |
| 代理商： | LM2704MFX-ADJ/NOPB |
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
V
IN
7.5V
SW Voltage
21V
FB Voltage
2V
SHDN Voltage
7.5V
Maximum Junction Temp. T
J
150C
Lead Temperature
(Soldering 10 sec.)
300C
Vapor Phase
(60 sec.)
215C
Infrared
(15 sec.)
220C
ESD Ratings (Note 3)
Human Body Model
Machine Model (Note 4)
2kV
200V
Operating Conditions
Junction Temperature
40C to +125C
Supply Voltage
2.2V to 7V
SW Voltage Max.
20.5V
Electrical Characteristics (Note 5)
Specifications in standard type face are for T
J = 25C and those in boldface type apply over the full Operating Temperature
Range (T
J = 40C to +125C). Unless otherwise specified. VIN =2.2V.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
I
Q
Device Disabled
FB = 1.3V
40
70
A
Device Enabled
FB = 1.2V
235
300
Shutdown
SHDN = 0V
0.01
2.5
V
FB
Feedback Trip Point
1.189
1.237
1.269
V
I
CL
Switch Current Limit
490
420
550
610
620
mA
I
B
FB Pin Bias Current
FB = 1.23V (Note 7)
30
120
nA
V
IN
Input Voltage Range
2.2
7.0
V
R
DSON
Switch R
DSON
0.7
1.6
T
OFF
Switch Off Time
400
ns
I
SD
SHDN Pin Current
SHDN = V
IN,TJ = 25C
080
nA
SHDN = V
IN,TJ = 125C
15
SHDN = GND
0
I
L
Switch Leakage Current
V
SW = 20V
0.05
5
A
UVP
Input Undervoltage Lockout
ON/OFF Threshold
1.8
V
FB
Hysteresis
Feedback Hysteresis
8
mV
SHDN
Threshold
SHDN low
0.7
0.3
V
SHDN High
1.1
0.7
θ
JA
Thermal Resistance
220
C/W
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to
be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA,
and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient
temperature is calculated using: PD (MAX) = (TJ(MAX) TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 4: ESD susceptibility using the machine model is 150V for SW pin.
Note 5: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality
Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 6: Typical numbers are at 25C and represent the most likely norm.
Note 7: Feedback current flows into the pin.
LM2704
www.national.com
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