參數(shù)資料
型號: LM193
廠商: NXP Semiconductors N.V.
英文描述: Low power dual voltage comparator
中文描述: 低功耗雙電壓比較器
文件頁數(shù): 3/18頁
文件大?。?/td> 413K
代理商: LM193
SLCS005S JUNE 1976 REVISED OCTOBER 2004
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
symbol (each comparator)
IN+
IN
OUT
schematic (each comparator)
80-
μ
A
Current Regulator
80
μ
A
60
μ
A
10
μ
A
VCC
10
μ
A
OUT
GND
IN+
IN
Epi-FET
Diodes
Resistors
Transistors
Current values shown are nominal.
COMPONENT COUNT
1
2
2
30
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC
(see Note 1)
Differential input voltage, V
ID
(see Note 2)
Input voltage range, V
I
(either input)
Output voltage, V
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, I
O
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 3)
Package thermal impedance,
θ
JA
(see Notes 4 and 5): D package
36 V
±
36 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.3 V to 36 V
36 V
20 mA
Unlimited
97
°
C/W
172
°
C/W
85
°
C/W
95
°
C/W
149
°
C/W
5.61
°
C/W
14.5
°
C/W
150
°
C
260
°
C
300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGK package
. . . . . . . . . . . . . . . . . . . . . . . .
P package
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
PS package
. . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package
. . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . .
JG package
. . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θ
JC
(see Notes 6 and 7): FK package
Operating virtual junction temperature, T
J
Case temperature for 60 seconds: FK package
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package
Storage temperature range, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max),
θ
JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) TA)/
θ
JA. Operating at the absolute maximum TJ of 150
°
C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max),
θ
JC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) TC)/
θ
JC. Operating at the absolute maximum TJ of 150
°
C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
. . . . . . . . . . . . . . . . . . . .
65
°
C to 150
°
C
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