參數(shù)資料
型號: LG1626DXC
英文描述: LG1626DXC Modulator Driver
中文描述: LG1626DXC調(diào)制器驅(qū)動(dòng)
文件頁數(shù): 9/10頁
文件大?。?/td> 264K
代理商: LG1626DXC
Lucent Technologies Inc.
9
Data Sheet
February 1999
LG1626DXC Modulator Driver
Outline Diagram
12-3224(F).a
Assembly Notes
:
Standoff specifications applies to package prior to solder dipping of leads and package base.
During board assembly use back lighting to silhouette the package. This will eliminate reflection problems with the
solder on the bottom of the package.
Lead space tolerance should be set to
±
0.012 in.
Board solder pattern for the package base should not exceed 50% of the package base area.
Insertion pressure should not exceed 125 grams.
LG1626DXC Ordering Information
Device
LG1626DXC
Type
Comcode Number
108192865
24-Pin Package
1
1
0 — 0.004
0.082
0.005
0.092
0.045
0.035
0.030
0.012
0.280
0.465
LUCENT
LG1626DXC
XXXXXXX
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