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參數資料
| 型號： | LDEEC3120 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | PEN-PET H.T |
| 中文描述： | 筆聚酯羥色胺 |
| 文件頁數： | 8/8頁 |
| 文件大?。?/td> | 499K |
| 代理商： | LDEEC3120 |
CAUTION
S
Hand assembly
If PC boards are assembled by hand, care must be taken
to avoid mechanical damage. We recommend:
- Use tweezers, the components should be gripped
across the two terminals, A.
- Avoid any contact with the cut surface, C.
- The usage of a pen under vacuum on the surface B
is recommended.
A
B
C
A
C
B
A = Termination surface
B = External surface
C = Cut surface
Fig. 1
S
Soldering iron
In case ofhand soldering the followingrecommandations
must be taken:
- Maximum temperature:
iron.
- Soldering time:
- Avoid contact between the iron soldering and chip.
250
_
C on the soldering
5 s max.
S
Soldering and flux recommendation
- Solder:
SnPb solder paste
- Flux:
no-clean flux.
S
Cleaning
To clean flux from the PC board assembly, use a suitable
solvent such as Isopropylalcohol.
Solvents such as Toluene, Xylene and Trichloroethylene
should be avoided.
CORRECTIVE ACTIONS TABLE (problems after soldering process)
TYPE OF DEFECT
CAUSE
POSSIBLE SOLUTION / ACTION
- see page 11 /end user
- see page 11 /end user
- see page 11 /end user
- decrease time of preheating or
change the orientation of P.C.B.
board/end user.
- apply suggested thermal profile
(page 11) / end user
- apply suggested thermal profile
(page 11) / end user
- see use suggestion
(page 11) / end user
- take care to hand assembly
(page 12) / end user
- wrong landing area
- quality of solder paste
- thermal profile
- bad temperature distribution into the
reflow oven
No solder joint in one end termination
- too high temperature
Mechanical deformation of the body
- too long time
- moisture inside capacitor
Short circuit
- mechanical damage
Do not hesitate to contact our Technical Service for any doubt or more detailed information.
LDE Series
PEN -- PET H.T.
12
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