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參數(shù)資料
| 型號： | LD6805K |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Low-dropout regulators, low noise, 150 mA |
| 封裝： | LD6805K/22P<SOT1194|<<<1<Always Pb-free,;LD6805K/12H<SOT1194|<<<1<Always Pb-free,;LD6805K/14H<SOT1194|<<<1<Always Pb-free,;LD6805K/20H<SOT1194|<<& |
| 文件頁數(shù)： | 12/19頁 |
| 文件大?。?/td> | 573K |
| 代理商： | LD6805K |
LD6805_SER
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Objective data sheet
Rev. 1 — 22 September 2011
12 of 19
NXP Semiconductors
LD6805 series
Low-dropout regulators, low noise, 150 mA
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| LD6805K/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 150MA 4HUSON |
| LD6805K/12H,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6805K/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 150MA 4HUSON 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 150MA, 4HUSON 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 150MA, 4HUSON; Primary Input Voltage:5.5V; Output Voltage Fixed:1.2V; Dropout Voltage Vdo:250mV; Voltage Regulator Case Style:SOT-1194-1; No. of Pins:4; Output Current:150mA; Operating Temperature Min:-40C; Operating ;RoHS Compliant: Yes |
| LD6805K/12P,115 | 功能描述:低壓差穩(wěn)壓器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| LD6805K/12P115 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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