參數(shù)資料
型號(hào): L6924D013TR
廠商: STMICROELECTRONICS
元件分類: 電源管理
英文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, QCC16
封裝: 3 X 3 MM, VFQFPN-16
文件頁(yè)數(shù): 24/38頁(yè)
文件大小: 1454K
代理商: L6924D013TR
Additional applications information
L6924D
30/38
Doc ID 11908 Rev 9
9
Additional applications information
9.1
Selecting the input capacitor
In most applications, a 1 F ceramic capacitor, placed close to the VIN and VINSN pins can
be used to filter the high frequency noise.
9.2
Selecting the output capacitor
Typically, 1 F ceramic capacitor placed close to the VOUT and VOUTSN pin is enough to
keep voltage control loop stable. This ensures proper operation of battery absent detection
in removable battery pack applications.
9.3
Layout guidelines and demonstration board description
The thermal loop keeps the device at a constant temperature of approximately 120°C which
in turn, reduces ICHG. However, in order to maximize the current capability, it is important to
ensure a good thermal path. Therefore, the exposed pad must be properly soldered to the
board and connected to the other layer through thermal vias. The recommended copper
thickness of the layers is 70 m or more.
The exposed pad must be electrically connected to GND. Figure 25 shows the thermal
image of the board with the power dissipation of 1 W. In this instance, the temperature of the
case is 89°C, but the junction temperature of the device is given by the following equation:
Equation 27
Where the RTH J-A of the device mounted on board is 75 °C/W, the power dissipated is 1 W,
and the ambient temperature is 25 °C.
In this case the junction temperature is:
Equation 28
AMB
DISS
A
THJ
J
T
P
R
T
+
×
=
C
T
J
o
100
25
1
75
=
+
×
=
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