31 FN6807.4 October 1, 2010 ADC Evaluation Platform Intersil offers an ADC Evaluation platform which can be used to evaluate any of th" />
參數(shù)資料
型號: KAD5512P-17Q48
廠商: Intersil
文件頁數(shù): 25/36頁
文件大?。?/td> 0K
描述: IC ADC 12BIT 170MSPS SGL 48-QFN
產(chǎn)品培訓(xùn)模塊: High-Speed Analog-to-Digital Converters
標(biāo)準(zhǔn)包裝: 1
系列: FemtoCharge™
位數(shù): 12
采樣率(每秒): 170M
數(shù)據(jù)接口: 串行,SPI?
轉(zhuǎn)換器數(shù)目: 1
功率耗散(最大): 253mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 48-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 48-QFN(7x7)
包裝: 托盤
輸入數(shù)目和類型: 1 個差分,單極
KAD5512P
31
FN6807.4
October 1, 2010
ADC Evaluation Platform
Intersil offers an ADC Evaluation platform which can be
used to evaluate any of the KADxxxxx ADC family. The
platform consists of a FPGA based data capture
motherboard and a family of ADC daughtercards. This
USB based platform allows a user to quickly evaluate the
ADC’s performance at a user’s specific application
frequency requirements. More information is available at:
http://www.intersil.com/converters/adc_eval_platform/
Layout Considerations
PCB Layout Example
For an example application circuit and PCB layout, please
refer to the evaluation board documentation provided in
the web product folder at:
There are separate evaluation boards for the 48-lead and
72-lead packages.
Split Ground and Power Planes
Data converters operating at high sampling frequencies
require extra care in PC board layout. Many complex
board designs benefit from isolating the analog and
digital sections. Analog supply and ground planes should
be laid out under signal and clock inputs. Locate the
digital planes under outputs and logic pins. Grounds
should be joined under the chip.
Clock Input Considerations
Use matched transmission lines to the transformer inputs
for the analog input and clock signals. Locate transformers
and terminations as close to the chip as possible.
Exposed Paddle
The exposed paddle must be electrically connected to
analog ground (AVSS) and should be connected to a
large copper plane using numerous vias for optimal
thermal performance.
Bypass and Filtering
Bulk capacitors should have low equivalent series
resistance. Tantalum is a good choice. For best
performance, keep ceramic bypass capacitors very close
to device pins. Longer traces will increase inductance,
resulting in diminished dynamic performance and
accuracy. Make sure that connections to ground are
direct and low impedance. Avoid forming ground loops.
LVDS Outputs
Output traces and connections must be designed for 50Ω
(100Ω differential) characteristic impedance. Keep traces
direct and minimize bends where possible. Avoid crossing
ground and power-plane breaks with signal traces.
LVCMOS Outputs
Output traces and connections must be designed for 50Ω
characteristic impedance.
Unused Inputs
Standard logic inputs (RESETN, CSB, SCLK, SDIO) which
will not be operated do not require connection to ensure
optimal ADC performance. These inputs can be left
floating if they are not used. The SDO output must be
connected to OVDD with a 4.7kΩ resistor or the ADC will
not exit the reset state. Tri-level inputs (NAPSLP,
OUTMODE, OUTFMT, CLKDIV) accept a floating input as a
valid state, and therefore should be biased according to
the desired functionality.
General PowerPAD Design
Considerations
The following figure is a generic illustration of how to use
vias to remove heat from a QFN package with an
exposed thermal pad. A specific example can be found in
the evaluation board PCB layout previously referenced.
Filling the exposed thermal pad area with vias provides
optimum heat transfer to the PCB’s internal plane(s). Vias
should be evenly distributed from edge-to-edge on the
exposed pad to maintain a constant temperature across the
entire pad. Setting the center-to-center spacing of the vias
FIGURE 49. VCM_OUT OUTPUT
Equivalent Circuits (Continued)
VCM
AVDD
0.535V
+
FIGURE 50. PCB VIA PATTERN
相關(guān)PDF資料
PDF描述
VI-B1N-MW-F3 CONVERTER MOD DC/DC 18.5V 100W
MS27497P8F35PA CONN RCPT 6POS WALL MNT W/PINS
IDT72V3640L7-5PFI IC FIFO SS 1024X36 7-5NS 128TQFP
IDT72V3640L6PF IC FIFO SS 1024X36 6NS 128-TQFP
MS3101R24-10S CONN RCPT 7POS PANEL MNT W/SCKT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KAD5512P-17Q72 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-BIT 170MSPS SINGL ADC PROG LVDS/LVCMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
KAD5512P-21Q48 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-BIT 210MSPS SINGL ADC PROG LVDS/LVCMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
KAD5512P-21Q72 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-BIT 210MSPS SINGL ADC PROG LVDS/LVCMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
KAD5512P-25Q48 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-BIT 250MSPS SINGL PROG LVDS/LVCMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32
KAD5512P-25Q72 功能描述:模數(shù)轉(zhuǎn)換器 - ADC 12-BIT 250MSPS SINGL PROG LVDS/LVCMOS RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 結(jié)構(gòu):Sigma-Delta 轉(zhuǎn)換速率:125 SPs to 8 KSPs 分辨率:24 bit 輸入類型:Differential 信噪比:107 dB 接口類型:SPI 工作電源電壓:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-32