參數(shù)資料
型號: K4S281632F-UC75
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: 128Mb F-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant)
中文描述: 128Mb的的F -模與鉛SDRAM的規(guī)格54 TSOP-II免費(符合RoHS)
文件頁數(shù): 11/14頁
文件大小: 145K
代理商: K4S281632F-UC75
SDRAM 128Mb E-die (x4, x8, x16)
CMOS SDRAM
Rev. 1.4 February. 2004
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Notes
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
1.37
4.37
Volts/ns
3
Output fall time
tfh
1.30
3.8
Volts/ns
3
Output rise time
trh
2.8
3.9
5.6
Volts/ns
1,2
Output fall time
tfh
2.0
2.9
5.0
Volts/ns
1,2
1. Rise time specification based on 0pF + 50
to V
SS
, use these values to design to.
2. Fall time specification based on 0pF + 50
to V
DD
, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to V
SS
.
Notes :
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
Notes :
AC CHARACTERISTICS
(AC operating conditions unless otherwise noted)
Parameter
Symbol
- 60 (x16 only)
Min
6
-
- 75
Unit
Note
Max
Min
7.5
10
Max
CLK cycle
time
CAS latency=3
CAS latency=2
CAS latency=3
CAS latency=2
CAS latency=3
CAS latency=2
t
CC
1000
1000
ns
1
CLK to valid
output delay
t
SAC
5
-
5.4
6
ns
1,2
Output data
hold time
t
OH
2.5
-
2.5
2.5
1.5
1.0
1
3
3
ns
2
CLK high pulse width
CLK low pulse width
Input setup time
Input hold time
CLK to output in Low-Z
t
CH
t
CL
t
SS
t
SH
t
SLZ
2.5
2.5
1.5
0.8
1
ns
ns
ns
ns
ns
3
3
3
3
2
CLK to output
in Hi-Z
CAS latency=3
CAS latency=2
t
SHZ
5
-
5.4
6
ns
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