參數(shù)資料
型號(hào)： K1500SRP
元件分類： 晶閘管
英文描述： 170 V, SIDAC, DO-214
封裝： ROHS COMPLIANT, PLASTIC PACKAGE-2
文件頁(yè)數(shù)： 9/12頁(yè)
文件大?。?/td> 345K
代理商： K1500SRP
318
Revised:December21,2010 02:40PM
2010 Littelfuse, Inc
Teccor brand Thyristors
Specications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
Standard Bidirectional SIDACs
Kxxxzy Series
Soldering Parameters
Reow Condition
Pre Heat
- Temperature Min (T
s(min))
150°C
- Temperature Max (T
s(max))
200°C
- Time (min to max) (t
s)
60 – 180 secs
Average ramp up rate (Liquidus Temp)
(T
L) to peak
5°C/second max
T
S(max) to TL - Ramp-up Rate
5°C/second max
Reow
- Temperature (T
L) (Liquidus)
- Temperature (t
L)
60 – 150 seconds
Peak Temperature (T
P)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peak Temperature (T
P)
Do not exceed
280°C
Time
T
emperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
Ramp-up
Ramp-down
Ramp-do
Physical Specications
Reliability/Environmental Tests
Test
Specications and Conditions
High Temperature
Voltage Blocking
hours
Temperature Cycling
-40°C to 150°C, 15-minute dwell, 100
Biased Temperature &
Humidity
EIA/JEDEC: JESD22-A101
DC
hours
High Temp Storage
150°C, 1008 hours
Low-Temp Storage
-40°C, 1008 hours
Thermal Shock
0°C to 100°C, 5-minute dwell,
Autoclave
(Pressure Cooker Test)
EIA/JEDEC: JESD22-A102
Resistance to
Solder Heat
260°C, 10 seconds
Solderability
Lead Bend
Terminal Finish
Dipped
Body Material
Lead Material
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
SIDACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.
相關(guān)PDF資料
PDF描述
K1050E70AP 113 V, SIDAC, TO-92
K1050E70 113 V, SIDAC, TO-92
K2000E70AP 215 V, SIDAC, TO-92
K1050GRP 113 V, SIDAC, DO-15
K1050G 113 V, SIDAC, DO-15
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