- 您現(xiàn)在的位置：買賣IC網 > PDF目錄360998 > ISP1106 (NXP Semiconductors N.V.) Advanced Universal Serial Bus transceivers PDF資料下載
參數(shù)資料
| 型號： | ISP1106 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Advanced Universal Serial Bus transceivers |
| 中文描述： | 先進的通用串行總線收發(fā)器 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 588K |
| 代理商： | ISP1106 |
Philips Semiconductors
ISP1105/1106/1107
Advanced USB transceivers
Product data
Rev. 06 — 30 November 2001
20 of 24
9397 750 08872
Koninklijke Philips Electronics N.V. 2001. All rights reserved.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
14.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
14.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
Table 18:
Suitability of surface mount IC packages for wave and reflow soldering
methods
Soldering method
Wave
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
PLCC
[3]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Package
Reflow
[1]
suitable
suitable
not suitable
not suitable
[2]
suitable
not recommended
[3][4]
not recommended
[5]
suitable
suitable
suitable
相關PDF資料 |
PDF描述 |
|---|---|
| ISP1106DH | GT 10C 10#16 SKT PLUG |
| ISP1106W | GT 5C 5#16 PIN PLUG |
| ISP1107 | Advanced Universal Serial Bus transceiver |
| ISP1107DH | Advanced Universal Serial Bus transceivers |
| ISP1107W | Advanced Universal Serial Bus transceivers |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1106DH | 功能描述:USB 接口集成電路 USB1.1 LOW VOLT TRANSCEIVER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1106DH,112 | 功能描述:USB 接口集成電路 USB1.1 LOW VOLTAGE TRANSCEIVER RoHS:否 制造商:Cypress Semiconductor 產品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1106DH,118 | 功能描述:射頻收發(fā)器 USB1.1 LOW VOLTAGE TRANSCEIVER RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| ISP1106DHAA | 功能描述:IC USB TRANSCEIVER 16-TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 標準包裝:1,000 系列:- 類型:收發(fā)器 驅動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:3 V ~ 5.5 V 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.295"，7.50mm 寬） 供應商設備封裝:16-SOIC 包裝:帶卷 (TR) |
| ISP1106DHTM | 功能描述:IC TXRX SERIAL BUS ADV 16TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 驅動器，接收器，收發(fā)器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:25 系列:- 類型:收發(fā)器 驅動器/接收器數(shù):2/2 規(guī)程:RS232 電源電壓:4.5 V ~ 5.5 V 安裝類型:通孔 封裝/外殼:16-DIP（0.300"，7.62mm） 供應商設備封裝:16-PDIP 包裝:管件 |
發(fā)布緊急采購，3分鐘左右您將得到回復。