Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 14 October 2003
Document order number: 9397 750 11229
Contents
Philips Semiconductors
ISP1104
Advanced USB transceiver
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
8
8.1
8.2
9
10
11
12
13
14
15
16
16.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 5
Function selection. . . . . . . . . . . . . . . . . . . . . . . 5
Operating functions. . . . . . . . . . . . . . . . . . . . . . 5
Power supply configurations. . . . . . . . . . . . . . . 6
Electrostatic discharge (ESD). . . . . . . . . . . . . . 7
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 7
ESD test conditions . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 11
Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Packaging. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 16
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
Additional soldering information . . . . . . . . . . 19
(H)BCC packages: footprint . . . . . . . . . . . . . . 19
(H)BCC packages: reflow soldering profile. . . 19
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
16.2
16.3
16.4
16.5
17
17.1
17.2
18
19
20
21