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3
FN6265.0
December 21, 2006
Absolute Maximum Ratings
Thermal Information
Lx to GND, AGND and PGND . . . . . . . . . . . . . . . . . . . . -0.5 to +25V
VDD2, OUT, NEG and POS
to GND, AGND and PGND . . . . . . . . . . . . . . . . . . . . . -0.5 to +25V
VDD1, VGH and VGH_M
to GND, AGND and PGND . . . . . . . . . . . . . . . . . . . . . -0.5 to +32V
Differential Voltage Between POS and NEG . . . . . . . . . . . . . . . ±6V
Voltage Between GND, AGND and PGND . . . . . . . . . . . . . . . ±0.5V
All Other Pins to GND, AGND and PGND. . . . . . . . . . -0.5 to +6.5V
Input, Output, or I/O Voltage . . . . . . . . . . .GND -0.3V to VIN + 0.3V
Recommended Operating Conditions
Input Voltage Range, VS . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 5.5V
Boost Output Voltage Range, AVDD . . . . . . . . . . . . . . . . . 8V to 20V
Input Capacitance, CIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22μF
Boost Inductor, L1 . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3μH to 10μH
LDO Output Capacitance. . . . . . . . . . . . . . . . . . . . . . .2.2μF to 10μF
Output Capacitance, COUT. . . . . . . . . . . . . . . . . . . . . . . . . .2x22μF
Operating Ambient Temperature Range . . . . . . . . . .-40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . .-40°C to +125°C
Thermal Resistance
4x4 QFN Package (Notes 1, 2) . . . . . .
Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Continuous Junction Temperature . . . . . . . . . . . +125°C
Power Dissipation
T
A
≤ +
25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.44W
T
A
= +70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.34W
T
A
= +85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.98W
T
A
= +100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.61W
θ
JA
(°C/W)
39
θ
JC
(°C/W)
2.5
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
2. For
θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
V
IN1
= V
IN2
= ENABLE = 5V, VDD1 = VDD2 = 14V, VGH = 25V, AVDD = 10V, T
A
= -40°C to +85°C
Unless Otherwise Noted.
SYMBOL
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
GENERAL
V
S
V
IN1
, V
IN2
Input Voltage Range
See separate LDO specifications
3.0
5.0
5.5
V
I
S_DIS
Sum of V
IN1
, V
IN2
Supply Currents
when Disabled
ENABLE = 0V
0.2
2
μA
I
S
Sum of V
IN1
, V
IN2
Supply Currents
ENABLE = 5V, LX not switching, LDO
not loaded
1
mA
UVLO
Undervoltage Lockout Threshold
V
IN2
Rising
2.3
2.45
2.6
V
V
IN2
Falling
2.2
2.35
2.5
V
OT
R
Thermal Shutdown Temperature
Temperature Rising
140
C
OT
F
Temperature Falling
100
C
LOGIC INPUT CHARACTERISTICS - ENABLE, VFLK, FREQ, VDPM
V
IL
Low Voltage Threshold
0.8
V
V
IH
High Voltage Threshold
2.2
V
R
IL
Pull-Down Resistor
Enabled, Input at V
IN2
150
250
400
k
Ω
STEP-UP SWITCHING REGULATOR
A
VDD
Output Voltage Range
VIN*1.25
20
V
Δ
A
VDD
/
Δ
I
OUT
Load Regulation
50mA < ILOAD < 250mA
0.2
%
Δ
A
VDD
/
Δ
V
IN
Line Regulation
ILOAD = 150mA, 3.0 < V
IN1
< 5.5V
0.15
0.25
%/V
ACC
AVDD
Overall Accuracy (Line, Load,
Temperature)
10mA < ILOAD < 300mA, 3.0 < V
IN1
< 5.5V, 0°C < T
A
< +85°C
-3
3
%
ISL97646