- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384533 > ISL97645 (Intersil Corporation) Boost + VON Slice + VCOM PDF資料下載
參數(shù)資料
| 型號(hào)： | ISL97645 |
| 廠商： | Intersil Corporation |
| 英文描述： | Boost + VON Slice + VCOM |
| 中文描述： | 升壓馮片威科姆 |
| 文件頁(yè)數(shù)： | 13/14頁(yè) |
| 文件大?。?/td> | 535K |
| 代理商： | ISL97645 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)當(dāng)前第13頁(yè)第14頁(yè)
13
FN9263.0
April 11, 2006
Layout Recommendation
The device’s performance including efficiency, output noise,
transient response and control loop stability is dramatically
affected by the PCB layout. PCB layout is critical, especially
at high switching frequency.
There are some general guidelines for layout:
1. Place the external power components (the input
capacitors, output capacitors, boost inductor and output
diodes, etc.) in close proximity to the device. Traces to
these components should be kept as short and wide as
possible to minimize parasitic inductance and resistance.
2. Place V
IN
and VDD bypass capacitors close to the pins.
3. Reduce the loop area with large AC amplitudes and fast
slew rate.
4. The feedback network should sense the output voltage
directly from the point of load, and be as far away from LX
node as possible.
5. The power ground (PGND) and signal ground (SGND)
pins should be connected at only one point.
6. The exposed die plate, on the underneath of the
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
7. To minimize the thermal resistance of the package when
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
8. A signal ground plane, separate from the power ground
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for control circuit.
9. Minimize feedback input track lengths to avoid switching
noise pick-up.
A demo board is available to illustrate the proper layout
implementation.
ISL97645
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISL97645IRZ | Boost + VON Slice + VCOM |
| ISL97645IRZ-T | Boost + VON Slice + VCOM |
| ISL97645IRZ-TK | Boost + VON Slice + VCOM |
| ISL97646 | Boost + LDO + VON Slice + VCOM |
| ISL97646IRZ-T | Boost + LDO + VON Slice + VCOM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL97645AIRZ | 功能描述:IC REG BOOST VON VCOM 24-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| ISL97645AIRZ-T | 功能描述:IC REG BOOST VON VCOM 24-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| ISL97645AIRZ-TK | 功能描述:IC REG BOOST VON VCOM 24-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| ISL97645IRZ-T | 功能描述:IC REG BOOST VON VCOM 24-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:手持/移動(dòng)設(shè)備 電流 - 電源:- 電源電壓:3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:14-LLP-EP（4x4） 包裝:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名稱:LP3905SD-30DKR |
| ISL97645IRZ-TK | 功能描述:IC REG BOOST VON VCOM 24-QFN RoHS:是 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:手持/移動(dòng)設(shè)備 電流 - 電源:- 電源電壓:3 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:14-LLP-EP（4x4） 包裝:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名稱:LP3905SD-30DKR |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。