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3
Absolute Maximum Ratings
Thermal Information
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
Input Voltages
IN, NO, NC, COM (Note 2) . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (NO, NC, or COM) . . . . . . . . . . . . . . . . . . 30mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Operating Conditions
Temperature Range
ISL832XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note
3)θJA (oC/W)
8 LD SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC
Moisture Sensitivity (See Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range . . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 5V Supply
Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4), Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
0
-
V+
V
ON Resistance, RON
V+ = 4.5V, ICOM = 1.0mA, VNO or VNC = 3.5V,
25
-
60
Full
-
75
RON Matching Between Channels,
R
ON
V+ = 5V, ICOM = 1.0mA, VNO or VNC= 3V
25
-
0.8
2
Full
-
4
RON Flatness, RFLAT(ON)
V+ = 5V, ICOM = 1.0mA, VNO or VNC = 1V, 2V, 3V
Full
-
7
8
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
25
-0.1
-
0.1
nA
Full
-5
-
5
nA
COM OFF Leakage Current,
ICOM(OFF)
V+ = 5.5V, VCOM = 4.5V, 1V, VNO or VNC = 1V, 4.5V,
25
-0.1
-
0.1
nA
Full
-5
-
5
nA
COM ON Leakage Current,
ICOM(ON)
V
+ = 5.5V, VCOM = 5V, or VNO or VNC = 5V, Note 6 25
-0.2
-
0.2
nA
Full
-10
-
10
nA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VNO or VNC = 3V, RL =1k, CL = 35pF, VIN = 0 to 3V,
25
-
150
ns
Full
-
240
ns
Turn-OFF Time, tOFF
VNO or VNC = 3V, RL =1k, CL = 35pF, VIN = 0 to 3V,
25
-
100
ns
Full
-
150
ns
Break-Before-Make Time Delay
(ISL8325), tD
RL = 300, CL = 35pF, VNO = VNC = 3V, VIN = 0 to 3V,
Full
2
10
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, See Figure 2 25
-
5
pC
OFF Isolation
RL = 50, CL = 5pF, f = 1MHz, See Figure 4 25
-
72
-
dB
Crosstalk (Channel-to-Channel)
RL = 50, CL = 5pF, f = 1MHz, See Figure 6 25
-
-85
-
dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 25
-
9
-
pF
COM OFF Capacitance,
CCOM(OFF)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 25
-
9
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7 25
-
22
-
pF
POWER SUPPLY CHARACTERISTICS
Power Supply Range
Full
2.7
12
V
Positive Supply Current, I+
V+ = 5.5V, VIN = 0V or V+, all channels on or off
Full
-1
0.0001
1
A
ISL8323, ISL8324, ISL8325