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參數(shù)資料
| 型號： | ISL5957 |
| 廠商： | Intersil Corporation |
| 英文描述： | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| 中文描述： | 14位，3.3伏，260 MSPS的，高速D / A轉換 |
| 文件頁數(shù)： | 12/13頁 |
| 文件大?。?/td> | 630K |
| 代理商： | ISL5957 |
12
FN6080.1
November 12, 2004
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
μ
α
0.25(0.010)
B
M
M
M28.3
(JEDEC MS-013-AE ISSUE C
)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
ISL5957
相關PDF資料 |
PDF描述 |
|---|---|
| ISL5957IA | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IAZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IB | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IBZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957EVAL1 | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ISL5957EVAL1 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IA | 功能描述:IC DAC 14-BIT 260MSPS 28-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:2,400 系列:- 設置時間:- 位數(shù):18 數(shù)據接口:串行 轉換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應商設備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| ISL5957IAZ | 功能描述:CONV D/A 14-BIT 3.3V 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1,000 系列:- 設置時間:1µs 位數(shù):8 數(shù)據接口:串行 轉換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應商設備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| ISL5957IB | 功能描述:IC DAC 14-BIT 260MHZ 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據采集 - 數(shù)模轉換器 系列:- 標準包裝:2,400 系列:- 設置時間:- 位數(shù):18 數(shù)據接口:串行 轉換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應商設備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| ISL5957IBZ | 功能描述:數(shù)模轉換器- DAC 14-BIT DAC 260MHZ ’-40/+85C 2 8LD RoHS:否 制造商:Texas Instruments 轉換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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