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參數(shù)資料
| 型號(hào)： | ISL5861IB |
| 廠商： | INTERSIL CORP |
| 元件分類： | DAC |
| 英文描述： | 12-bit, +3.3V, 130/210MSPS, CommLinkTM High Speed D/A Converter |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 0.035 us SETTLING TIME, 12-BIT DAC, PDSO28 |
| 封裝： | PLASTIC, MS-013AE, SOIC-28 |
| 文件頁(yè)數(shù)： | 12/13頁(yè) |
| 文件大小： | 906K |
| 代理商： | ISL5861IB |
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12
ISL5861
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
μ
α
0.25(0.010)
B
M
M
M28.3
(JEDEC MS-013-AE ISSUE C
)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
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| ISL5861IBZ | 功能描述:CONV D/A 12-BIT HS 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
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