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參數(shù)資料
| 型號： | ISL5761 |
| 廠商： | Intersil Corporation |
| 英文描述： | 10-bit, +3.3V, 130/210MSPS, CommLink TM High Speed D/A Converter |
| 中文描述： | 10位，3.3伏，130/210MSPS，CommLink商標(biāo)高速D / A轉(zhuǎn)換 |
| 文件頁數(shù)： | 3/13頁 |
| 文件大?。?/td> | 1105K |
| 代理商： | ISL5761 |
3
Pin Descriptions
PIN NO.
PIN NAME
DESCRIPTION
1-10
D9 (MSB) Through
D0 (LSB)
Digital Data Bit 9, (Most Signi
fi
cant Bit) through Digital Data Bit 0, (Least Signi
fi
cant Bit).
15
SLEEP
Control Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep pin
has internal 20
μ
A active pulldown current.
16
REFLO
Connect to analog ground to enable internal 1.2V reference or connect to AV
DD
to disable internal reference.
17
REFIO
Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is
enabled. Use 0.
1μ
F cap to ground when internal reference is enabled.
18
FSADJ
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output Current
= 32 x V
FSADJ
/R
SET
.
19, 25
NC
No Connect. These should be grounded, but can be left disconnected.
21
IOUTB
The complementary current output of the device. Full scale output current is achieved when all input bits are
set to binary 0.
22
IOUTA
Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23
COMP
Connect 0.1
μ
F capacitor to ACOM.
24
AV
DD
Analog Supply (+3.0V to +3.6V).
20
ACOM
Connect to Analog Ground.
26, 11-14
DCOM
Connect to Digital Ground.
27
DV
DD
Digital Supply (+3.0V to +3.6V).
28
CLK
Clock Input.
ISL5761
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISL5761/21A | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| ISL5761/2IA | 功能描述:IC DAC 10BIT 130MSPS 28-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| ISL5761/2IAZ | 功能描述:CONV D/A 10BIT HS LP 28-TSSOP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
| ISL5761/2IB | 功能描述:IC DAC 10-BIT 210MSPS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| ISL5761/2IBZ | 功能描述:CONV D/A 10BIT HS LP 28-SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1,000 系列:- 設(shè)置時(shí)間:1µs 位數(shù):8 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:8 電壓電源:雙 ± 功率耗散（最大）:941mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC W 包裝:帶卷 (TR) 輸出數(shù)目和類型:8 電壓，單極 采樣率（每秒）:* |
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