參數(shù)資料
型號(hào): ISL54051IRUZ-T
廠商: INTERSIL CORP
元件分類: 運(yùn)動(dòng)控制電子
英文描述: Ultra Low ON-Resistance, Low Voltage, Single Supply, Single SPST Analog Switches
中文描述: 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO6
封裝: 1.2 X 1.0 MM, 0.50 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MO-255, UTDFN-6
文件頁(yè)數(shù): 10/10頁(yè)
文件大小: 264K
代理商: ISL54051IRUZ-T
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6459.0
March 16, 2007
ISL54051, ISL54052
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
B
D
A
E
0.10 C
2X
PIN 1
TOP VIEW
0.10 C
2X
REFERENCE
DETAIL A
0.10 C
0.08 C
7X
A3
A1
A
C
SEATING
PLANE
5X
L
e
1
3
6
4
4X
BOTTOM VIEW
SIDE VIEW
0.10 C A B
0.05 C
b 6X
NOTE 3
L1
DETAIL A
DETAIL B PIN 1 LEAD
0.1x45°
CHAMFER
DETAIL B
A3
A1
1.40
LAND PATTERN
1.00
0.30
0.35
0.20
0.45
0.40
0.20
10
L6.1.2x1.0A
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
0.95
1.00
1.05
-
E
1.15
1.20
1.25
-
e
0.40 BSC
-
L
0.30
0.35
0.40
-
L1
0.40
0.45
0.50
-
N
6
2
Ne
3
3
θ
0
-
12
4
Rev. 2 8/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Ne refers to the number of terminals on E side.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
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