3
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
V- to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V
All Other Pins (Note 2) . . . . . . . . . . . . . ((V-) - 0.3V) to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, IN, NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV
Operating Conditions
Temperature Range
ISL43240IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical)
θJA (oC/W)
20 Ld SSOP Package (Note 3) . . . . . . . . . . . . . . . .
150
20 Ld QFN Package (Note 4). . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Moisture Sensitivity (See Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range. . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3.
θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
4.
θ
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
Electrical Specifications:
±5V Supply Test Conditions: V
SUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4),
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP
(oC)
(NOTE 5)
MIN
TYP
(NOTE 5)
MAX
UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
V-
-
V+
V
ON Resistance, RON
VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V,
See Figure 5
25
-
18
25
Full
-
30
RON Matching Between Channels,
RON
VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3V
25
-
0.5
2
Full
-
4
RON Flatness, RFLAT(ON)
VS = ±4.5V, ICOM = 10mA, VNO or VNC = 0V, ±3V,
Note 7
25
-
5
Full
-
5
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF)
VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V,
Note 6
25
-0.2
-
0.2
nA
Full
-2.5
-
2.5
nA
COM ON Leakage Current,
ICOM(ON)
VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, Note 6
25
-0.4
-
0.4
nA
Full
-5
-
5
nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH
Full
2.4
1.6
-
V
Input Voltage Low, VINL
Full
-
1.5
0.8
V
Input Current, IINH, IINL
VS = ±5.5V, VIN = 0V or V+
Full
-1
-
1
A
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON
VS = ±4.5V, VNO or VNC = ±3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, See Figure 1
25
-
52
65
ns
Full
-
75
ns
Turn-OFF Time, tOFF
VS = ±4.5V, VNO or VNC = ±3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, See Figure 1
25
-
40
50
ns
Full
-
55
ns
Break-Before-Make Time Delay, tD
VS = ±5.5V, VNO or VNC = ±3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, See Figure 3
Full
10
19
-
ns
Charge Injection, Q
CL = 1.0nF, VG = 0V, RG = 0, See Figure 2
25
-
5
pC
NO OFF Capacitance, COFF
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7
25
-
10
-
pF
NC OFF Capacitance, COFF
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7
25
-
10
-
pF
COM ON Capacitance, CCOM(ON)
f = 1MHz, VNO or VNC = VCOM = 0V, See Figure 7
25
-
30
-
pF
OFF Isolation
RL = 50, CL = 15pF, f = 1MHz,
VNO or VNC = 1VRMS, See Figures 4 and 6
25
-
71
-
dB
Crosstalk, Note 8
25
-
-92
-
dB
Power Supply Rejection Ratio
RL = 50, CL = 5pF, f = 1MHz
25
-
59
-
dB
ISL43240