參數(shù)資料
型號(hào)： ISD17210SYIR
廠商： WINBOND ELECTRONICS CORP
英文描述： Multi-Message Single-Chip Voice Record & Playback Devices
中文描述： 多信息單芯片語(yǔ)音記錄
文件頁(yè)數(shù)： 16/24頁(yè)
文件大?。?/td> 365K
代理商： ISD17210SYIR
ISD1700 SERIES
- 16 -
10 TYPICAL APPLICATION CIRCUITS
The following typical applications examples on ISD1700 Series are for references only. They make no
representation or warranty that such applications shall be suitable for the use specified. Each design
has to be optimized in its own system for the best performance on voice quality, current consumption,
functionalities and etc.
The below notes apply to the following applications examples:
*
These capacitors may be needed in order to optimize for the best voice quality, which is also dependent
upon the layout of the PCB. Depending on system requirements, they can be 10
μ
F, 4.7
μ
F or other values.
Please refer to the applications notes or consult Winbond for layout advice.
**
It is important to have a separate path for each ground and power back to the related terminals to minimize
the noise. Also, the power supplies should be decoupled as close to the device as possible
.
Example #1: Recording using microphone input via push-button controls
Vcc
ISD1700
R
OSC
V
CCA
V
SSA
V
CCP
V
SSP1
V
SSP2
SP+
SP-
AUD/AUX
ERASE
PLAY
REC
AGC
V
SSD
V
CCD
AnaIn
MIC -
MIC+
MISO
MOSI
SCLK
SS
FWD
VOL
FT
V
CCA
0.1 F
μ
V
CCD
*
24
23
25
26
19
10
11
20
18
1
28
17
22
9
V
CCA
V
CCD
V
CCP
V
CCP
0.1 F
0.1 F
*
*
21
8
14
16
12
0.1 F
*
INT/RDY
27
7
6
5
4
V
CC
4.7 F
Ω
4.7 K
0.1 F
4.7 K
Ω
0.1 F
4.7 K
Ω
**
**
*** At 8kHz sampling freq, Rosc = 80 K
Rosc ***
4.7 F
15
13
Speaker
or Buzzer
V
CCD
Optional
Ω
100 K
Optional: based upon the applications
390
Ω
0.1 F
V
CC
8050C
Speaker
AUX
AUD
Gnd
LED
1 K
Ω
D1
2
vAlert
3
RESET
0.1 F
Reset
: Digital ground; : Analog ground; : Ground for SP+; : Ground for SP-
相關(guān)PDF資料
PDF描述
ISD17210SYIR01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210SYR R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210SYR01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 32K; RAM: 2K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 62.5 (@16MHz); Operating Frequency / Supply Voltage: 16MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 125; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XY R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
ISD17210XY01 R8C; R8C/2x Series; Microcontroller; Bit Size: 32/16-bit CISC; ROM: 48K; RAM: 2.5K; ROM Type: Flash memory; CPU: R8C core; Minimum Instruction Execution Time (ns): 50 (@20MHz); Operating Frequency / Supply Voltage: 20MHz/3.0 to 5.5V, 10MHz/2.7 to 5.5V; Operating Ambient Temperature (°C): -40 to 85; Package Code: PLQP0048KB-A (48P6Q-A)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210SYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SYR 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語(yǔ)音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210SYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210XY01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
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