參數(shù)資料
型號： ISD17210PYI01
廠商： WINBOND ELECTRONICS CORP
英文描述： Multi-Message Single-Chip Voice Record & Playback Devices
中文描述： 多信息單芯片語音記錄
文件頁數(shù)： 2/24頁
文件大小： 365K
代理商： ISD17210PYI01
ISD1700 SERIES
- 2 -
TABLE OF CONTENTS
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3
FEATURES......................................................................................................................................4
BLOCK DIAGRAM...........................................................................................................................5
PINOUT CONFIGURATION............................................................................................................6
PIN DESCRIPTION.........................................................................................................................7
MODES OF OPERATIONS.............................................................................................................8
6.1
Standalone (Push-Button) Mode .............................................................................................8
6.2
SPI Mode .................................................................................................................................8
7
TIMING DIAGRAMS........................................................................................................................8
7.1
Standalone Operation..............................................................................................................8
7.2
SPI Operation.........................................................................................................................12
8
ABSOLUTE MAXIMUM RATINGS................................................................................................13
8.1
Operating Conditions.............................................................................................................13
9
ELECTRICAL CHARACTERISTICS .............................................................................................14
9.1
DC Parameters ......................................................................................................................14
9.2
AC Parameters.......................................................................................................................15
10
TYPICAL APPLICATION CIRCUITS.............................................................................................16
10.1
Good Audio Design Practices................................................................................................18
11
PACKAGING .................................................................................................................................19
11.1
28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19
11.2
28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20
11.3
28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................21
11.4
Die Information.......................................................................................................................21
12
ORDERING INFORMATION.........................................................................................................22
13
VERSION HISTORY......................................................................................................................23
相關(guān)PDF資料
PDF描述
ISD17210PYIR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210PYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210SY 功能描述:IC VOICE REC/PLAY 210SEC 28-SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時(shí)間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP（0.300"，7.62mm） 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
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