參數(shù)資料
型號: ISD17210PY
廠商: WINBOND ELECTRONICS CORP
英文描述: Multi-Message Single-Chip Voice Record & Playback Devices
中文描述: 多信息單芯片語音記錄
文件頁數(shù): 10/24頁
文件大?。?/td> 365K
代理商: ISD17210PY
ISD1700 SERIES
- 10 -
FWD
RDY
T
Deb
T
Sc1
T
RD
T
r
T
f
LED
T
Sc2
T
LS1
or T
LS2
> T
Deb
Figure 12.4: Forward Operation with No Sound Effect
Sp+, Sp-
Note: If SEs are recorded, then Sp+/- will have output.
ERASE
RDY
T
Deb
T
Sc1
T
RD
T
r
T
f
LED
T
GE1
or
(T
E
+ T
LS2
or
T
SE2
)
T
Sc2
T
GE2
3x(T
LS1
or
T
SE1
)
T
LS4
or
T
SE4
Figure 12.5: Global Erase Operation with or without Sound Effects
相關(guān)PDF資料
PDF描述
ISD17210PY01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYI Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYI01 Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 Multi-Message Single-Chip Voice Record & Playback Devices
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISD17210PY01 功能描述:IC VOICE REC/PLAY 210SEC 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210PYI 功能描述:IC VOICE REC/PLAY 210SEC 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210PYI01 功能描述:IC VOICE REC/PLAY 210SEC 28-DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 語音錄制和重放 系列:ISD1700, ChipCorder® 標(biāo)準(zhǔn)包裝:14 系列:- 接口:串行 濾波器通頻帶:1.7kHz 持續(xù)時間:8 ~ 32 秒 安裝類型:通孔 封裝/外殼:28-DIP(0.300",7.62mm) 供應(yīng)商設(shè)備封裝:28-PDIP 其它名稱:90-21300+000
ISD17210PYIR 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices
ISD17210PYIR01 制造商:WINBOND 制造商全稱:Winbond 功能描述:Multi-Message Single-Chip Voice Record & Playback Devices