參數(shù)資料
型號: IRFIZ48G
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=60V, Rds(on)=0.018ohm, Id=37A)
中文描述: 功率MOSFET(減振鋼板基本\u003d 60V的,的Rds(on)\u003d 0.018ohm,身份證\u003d 37A條)
文件頁數(shù): 1/8頁
文件大?。?/td> 93K
代理商: IRFIZ48G
IRFIZ48V
HEXFET
Power MOSFET
02/12/01
Parameter
Max.
39
27
290
43
0.29
± 20
72
15
5.3
Units
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
A
W
W/°C
V
A
mJ
V/ns
V
GS
I
AR
E
AR
dv/dt
T
J
T
STG
-55 to + 175
300 (1.6mm from case )
10 lbfin (1.1Nm)
°C
Absolute Maximum Ratings
Parameter
Typ.
–––
–––
Max.
3.5
65
Units
°C/W
R
θ
JC
R
θ
JA
Junction-to-Case
Junction-to-Ambient
Thermal Resistance
www.irf.com
1
V
DSS
= 60V
R
DS(on)
= 12m
I
D
= 39A
S
D
G
Advanced HEXFET
Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 Fullpak eliminates the need for additional
insulating hardware in commercial-industrial applications.
The moulding compound used provides a high isolation
capability and a low thermal resistance between the tab and
external heatsink. This isolation is equivalent to using a 100
micron mica barrier with standard TO-220 product. The
Fullpak is mounted to a heatsink using a single clip or by a
single screw fixing.
Advanced Process Technology
Ultra Low On-Resistance
Isolated Package
High Voltage Isolation = 2.5KVRMS
Fast Switching
Fully Avalanche Rated
Optimized for SMPS Applications
Description
TO-220 FULLPAK
PD-94072
相關(guān)PDF資料
PDF描述
IRFK6H054 ISOLATED BASE POWER HEX-PAK ASSEMBLY PARALLEL CHIP
IRFK6H150 ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
IRFK6H250 ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
IRFK6H350 ISOLATED BASE POWER HEX PAK ASSEMBLY PARALLEL CHIP CONFIGURATION
IRFK6H450 Isolated Base Power HEX-pak Assembly-Half Bridge Configuration
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