參數(shù)資料
型號: IRF7509TR
廠商: International Rectifier
英文描述: Power MOSFET(Vdss=+-30V)
中文描述: 功率MOSFET(減振鋼板基本\u003d - 30V的)
文件頁數(shù): 1/8頁
文件大?。?/td> 217K
代理商: IRF7509TR
IRF7509
PD - 91270J
G
Generation V Technology
G
Ultra Low On-Resistance
G
Dual N and P Channel MOSFET
G
Very Small SOIC Package
G
Low Profile (<1.1mm)
G
Available in Tape & Reel
G
Fast Switching
HEXFET
Power MOSFET
N-Ch
P-Ch
V
DSS
30V
-30V
R
DS(on)
0.11
0.20
12/1/98
Micro8
Fifth Generation HEXFETs from International Rectifier utilize advanced
processing techniques to achieve extremely low on-resistance per silicon
area. This benefit, combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for use in a wide variety
of applications.
The new Micro8 package, with half the footprint area of the standard SO-8,
provides the smallest footprint available in an SOIC outline. This makes the
Micro8 an ideal device for applications where printed circuit board space is at
a premium. The low profile (<1.1mm) of the Micro8 will allow it to fit easily into
extremely thin application environments such as portable electronics and
PCMCIA cards.
Description
D1
D1
D2
D2
G1
S2
G2
S1
Top View
8
2
3
4
5
6
7
1
P-CHANNEL MOSFET
www.irf.com
1
Parameter
Max.
Units
N-Channel P-Channel
V
DS
Drain-Source Voltage 30 -30 V
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
2.7 -2.0
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
2.1 -1.6
I
DM
Pulsed Drain Current
21 -16
P
D
@T
A
= 25°C
Maximum Power Dissipation
P
D
@T
A
= 70°C
Maximum Power Dissipation
Linear Derating Factor 10 mW/°C
V
GS
Gate-to-Source Voltage
± 20 V
V
GSM
Gate-to-Source Voltage Single Pulse tp<10μS 30 V
dv/dt
Peak Diode Recovery dv/dt
T
J
, T
STG
Junction and Storage Temperature Range
Soldering Temperature, for 10 seconds 240 (1.6mm from case)
A
1.25
0.8
W
W
5.0
V/ns
°C
-55 to + 150
Thermal Resistance
Parameter
Max. Units
100 °C/W
R
θ
JA
Maximum Junction-to-Ambient
Absolute Maximum Ratings
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