參數(shù)資料
型號: IPB04N03L
廠商: INFINEON TECHNOLOGIES AG
元件分類: 圓形連接器
英文描述: Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT02; Number of Contacts:10; Connector Shell Size:12; Connecting Termination:Crimp; Circular Shell Style:Box Mount Receptacle
中文描述: 的OptiMOS降壓轉(zhuǎn)換器系列
文件頁數(shù): 2/8頁
文件大小: 455K
代理商: IPB04N03L
2003-01-17
Page 2
IPP04N03L
IPB04N03L
Thermal Characteristics
Parameter
Symbol
Values
typ.
Unit
min.
max.
Characteristics
Thermal resistance, junction - case
SMD version, device on PCB:
R
thJC
R
thJA
-
0.51
0.8
K/W
@ min. footprint
@ 6 cm
2
cooling area
3)
-
-
-
-
62
40
Electrical Characteristics
, at
T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
Values
typ.
Unit
min.
max.
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V,
I
D
=1mA
Gate threshold voltage,
V
GS
=
V
DS
I
D
= 130 μA
Zero gate voltage drain current
V
(BR)DSS
30
-
-
V
V
GS(th)
1.2
1.6
2
V
DS
=30V,
V
GS
=0V,
T
j
=25°C
V
DS
=30V,
V
GS
=0V,
T
j
=125°C
Gate-source leakage current
I
DSS
-
-
0.01
10
1
100
μA
V
GS
=20V,
V
DS
=0V
Drain-source on-state resistance
I
GSS
-
1
100
nA
V
GS
=4.5V,
I
D
=45A
V
GS
=4.5V,
I
D
=45A, SMD version
Drain-source on-state resistance
4)
R
DS(on)
-
-
4.9
4.6
6.2
5.9
m
V
GS
=10V,
I
D
=45A
V
GS
=10V,
I
D
=45A, SMD version
R
DS(on)
-
-
3.6
3.2
4.2
3.9
1Current limited by bondwire ; with an
R
thJC
= 0.8K/W the chip is able to carry
I
D
= 165A at 25°C, for detailed
information see app.-note ANPS071E available at
www.infineon.com/optimos
2Defined by design. Not subject to production test.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 μm thick) copper area for drain
connection. PCB is vertical without blown air.
4Diagrams are related to straight lead versions
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