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參數(shù)資料
| 型號： | ILC-3F-2.0G |
| 廠商： | MERRIMAC INDUSTRIES INC |
| 元件分類： | 分路器/合路器 |
| 英文描述： | 1800 MHz - 2100 MHz RF/MICROWAVE SPLITTER AND COMBINER, 0.35 dB INSERTION LOSS |
| 文件頁數(shù)： | 1/5頁 |
| 文件大小： | 170K |
| 代理商： | ILC-3F-2.0G |
MUTLI-MIX F SERIES IN-LINE COUPLERS
The Multi-Mix ILC-F series provides a power divider and combiner function with low insertion loss, high
isolation, and high power handling in a small outline. The ILC series are composed of serial connected
multi-couplers with each coupler having a different nominal coupling value. Equal split loss is maintained
at all of the coupled ports, since the direct-path loss of previous couplers is added. Each of the paths
through a divider / combiner pair have equal insertion phase, but the individual port paths do not.
Accurate phase and amplitude balance make them ideal for applications involving power amplifiers,
signal distribution and processing.
ILC-F in-line couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical
performance that is superior to conventional adhesive bonding techniques.
The ILC-F series is an easy to install SMD designed specifically for the full spectrum of wireless
applications. The high stability ceramic filled PTFE dielectrics utilized in these components are
compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane
provides excellent EM shielding.
Additional benefits include:
Cost effective for commercial wireless applications
Operating temperature range –55°C to +85°C.
Can be integrated with other Multi-Mix components in a multi-function module
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,
Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life
Test (>1000 cycles).
THE MULTI-MIX PROCESS
Multi-Mix is a manufacturing process based on fluoropolymer composite substrates that are fusion
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous
monolithic structure with superior performance at microwave and millimeter wave frequencies. The
bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and
plated-through vias to form a SMD module that requires no additional packaging and is suitable for
automated assembly.
REV: 003, 10/11/01
IN-LINE COUPLERS
ILC-3F-2.0G
Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
TECHNICAL DESCRIPTION / APPLICATION
1.8 - 2.1 GHz
LOW LOSS
LOW VSWR
HIGH ISOLATION
SURFACE MOUNT
THE MULTI-MIX MICROTECHNOLOGY GROUP IS ISO-9001 REGISTERED
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